HD-3007 is a non-photodefinable polyimide precursor designed for use as a temporary or permanent adhesive in 3D packaging applications. This material exhibits thermoplastic behavior after cure and during bonding at moderate temperature and pressure. HD-3007 has high adhesion to silicon, glass, polyimide and other substrates.
HD-3007 has been used as a temporary adhesive bonding wafers to carrier wafers for backgrinding and other processes. Debonding has been demonstrated with laser, solvent and thermal release methods. Residual HD-3007 can be removed using a dry etch or solvent process.