DuPont offers a complete line of acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications.
Many standard and customized constructions of core dielectric, adhesive, and copper thicknesses are available to meet today's demanding design requirements requiring multiple high-temperature lamination cycles.
Superior bond strength and flexibility for high volume applications
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.
DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products here uniform matte black appearance is desired.
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.View Details
DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® HT is an all polyimide flexible laminate system with the highest service temperature available today, that includes a double-sided copper-clad laminate and a unique all polyimide coverfilm or bonding material.
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.View Details
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.