Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

DuPont Paper Featured in Scientific Journal Advances in Engineering

Dec 14, 2018

Industry journal Advances in Engineering recently featured a paper on flexible display-enabling technology co-authored by three E&I experts.

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Electronics & Imaging Director of Global Display Technology R&D Participates in Panel at 2018 China Display Technology Conference

Nov 01, 2018

At the 2018 China Display Technology Conference, Display Technologies executive Kathleen O’Connell sat on a panel of industry experts.

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Rick Hemond, CMO, to Keynote SEMI Strategic Materials Conference 2018

Sep 19, 2018

The 2018 Strategic Materials Conference will focus on how materials are shaping the future of electronics. At the event, DowDupont’s Rick Hemond will deliver a keynote addressing role of electronic materials in a future connected world.

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James Fahey, Business President, to Speak at SEMICON Taiwan 2018

Aug 29, 2018

DuPont Electronics & Imaging’s James Fahey and Rozalia Beica will give talks as part of highly anticipated programs set to take place during SEMICON Taiwan 2018. Programs include the IC60 Master Forum and the Advanced Packaging Technology Forum.

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Display Technologies Specialty Silicones Team Shares Solutions at Guangzhou International Lighting Exhibition

Aug 09, 2018

At the 2018 Guangzhou International Lighting Exhibition, Dow Display Technologies Specialty Silicones Team exhibited solutions for chip-scale packaging.

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Dow Michigan State Publish Jointly Authored OLED Paper

Jul 05, 2018

Joining forces with researchers from Michigan State, Dow has drawn on its expertise in OLED technology to jointly author a research paper on optimizing OLEDs’ performance.

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Dow Experts Share Quantum Dot Technology Expertise at Recent Events

Jun 06, 2018

Leveraging Dow’s knowledge in display technology, company experts presented on the growing quantum dot market at two recent industry events.

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ECTC 2018 Forges New Frontiers for Heterogeneous Integration

May 22, 2018

Dow Electronic Materials will be out in force at ECTC 2018 with our advanced electronics packaging experts and technology featured in multiple technical presentations covering fan-out wafer-level Packaging and more.

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Dow Expert Presents Innovative CSP LED Material Solution to Epistar

May 20, 2018

Leveraging Dow’s expertise in LED materials, Epistar has partnered with us to extend its LED package manufacturing business to integrate chip-scale packages (CSPs) LED packaging. This partnership will present new solutions for LEDs and beyond.

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Rozalia Beica To Provide the Material Supplier Perspective at ConFab 2018

May 17, 2018

Leading industry expert on semiconductor advanced packaging, Rozalia Beica, will represent industry suppliers in the ConFab 2018 Panel on Heterogeneous Integration on May 22. The ConFab program discusses the latest trends in semiconductor device manufacturing.

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Dow’s Asia CMP Center Celebrates Phase 4 Grand Opening

Apr 19, 2018

Dow Electronic Materials is expanding manufacturing operations for the production of pads for chemical mechanical planarization (CMP). Read on to see photos from the grand opening ceremony.

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MICROFILL™ SFP Acid Copper Earns Dow its Ninth NPI Award in 10 Years

Apr 10, 2018

Industry awards are one of the strongest endorsements of a company’s products, especially when judged by peers. Dow is honored to receive it’s ninth PCD&F NPI Award this year for MICROFILL™ SFP Acid Copper.

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Dow Litho and CMP Experts to Present Research at SEMICON China’s CSTIC

Mar 09, 2018

During the China Semiconductor Technology International Conference (CSTIC), representatives from Dow will share research on two topics: patterning materials for advanced 193nm immersion lithography, and the relationship between pad and slurry in CMP process optimization.

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IMAPS DPC 2018 to Explore the Future of Advanced Packaging

Feb 26, 2018

IMAPS Device Packaging Conference is always at the forefront of semiconductor advanced packaging, and this year, it will look into the future. Check out Dow presentations from Dow experts during this year’s event.

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Dow’s Peter Trefonas Named SPIE Fellow

Feb 26, 2018

Dow’s Peter Trefonas has been named a Fellow of SPIE, the international society for optics and photonics. Trefonas has been recognized for his achievements in design for manufacturing and compact modeling.

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Dow Prepares for the 2018 SPIE Advanced Lithography Conference

Jan 29, 2018

The SPIE Advanced Lithography conference is known for leading-edge technical research. In 2018, Dow will present on: improving performance through LWR analysis; the trade-offs of shot noise, LER and RLS; and innovative SiARC materials for implant lithography.

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Dow and DuPont Previewed Future Display Technologies at IMID 2017

Dec 11, 2017

The possibilities for future display technologies are seemingly endless, from OLED to flexible to quantum dot. Together Dow and DuPont recently showcased how they are advancing high performance displays with the latest materials innovations.

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Dow and DuPont to Exhibit at Productronica

Nov 02, 2017

With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?

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Nitta Haas Receives Siltronic's Long-Term Partner Award for Polishing Materials

Oct 30, 2017

One of the strongest endorsements of a company’s performance and product quality is through industry supplier awards. Dow is proud to announce that its joint venture Nitta Haas has received Siltronic's Long-Term Partner Award for polishing materials.

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Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference

Oct 16, 2017

Examining the “IMPACT on Intelligent Everything,” this year's IMPACT conference will feature papers from Dow on the latest technological advances for tin whiskers and HDI electroplating.

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Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award

Aug 02, 2017

As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.

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Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

Jun 21, 2017

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.

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Dow to Showcase New Metallization Chemistries at ECTC 2017

May 19, 2017

Dow is a proud sponsor of ECTC 2017. At this year’s show, we will introduce SOLDERON™ BP Indium 1000 and INTERVIA™ 9000 Cu products. Learn how these new products expand our metallization portfolio for emerging advanced packaging applications.

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James Thackeray Named SPIE Fellow

Apr 13, 2017

Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.

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NPI Awards Honor COPPER GLEAM™ PPR-II Acid Cu Plating

Mar 22, 2017

The annual NPI Awards recognize best-of-breed new products. We're proud to announce that Dow’s COPPER GLEAM™ PPR-II Acid Cu was named best new plating technology for 2017.

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Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC

Mar 10, 2017

Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.

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IMAPS Device Packaging Conference to Feature Next-Gen Materials and Trends

Feb 28, 2017

At this year’s IMAPS Device Packaging Conference, Dow experts will present sessions on Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices, and Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies.

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Dow Weighs in on the Heterogeneous Integration Roadmap for 2017

Feb 21, 2017

This year, industry publication 3D InCites asked companies to comment on the new initiative for a Heterogeneous Integration Technology Roadmap for Semiconductors. Dow’s Rob Kavanagh shares his opinion in his 2017 outlook.

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Advances in Patterning Materials and Processes at SPIE Advanced Lithography

Feb 20, 2017

Dow experts will present at this year’s SPIE Advanced Lithography as part of Advances in Patterning Materials and Processes Conference. Preview our presentations on embedded topcoat for EUV and soft spacer materials for advanced hole patterning.

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Dow to Present at Inaugural Electron Devices Technology and Manufacturing Conference

Feb 09, 2017

The Electron Devices Technology Manufacturing Conference came about from the industry’s increased interest in how system integration improves device performance. This year, Dow offers its take on advanced materials and interconnect technologies for next-gen smart devices.

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Dow to Present on Packaging for Smart Devices at European 3D Summit

Jan 19, 2017

At the European 3D Summit, Dow Electronic Materials’ Rozalia Beica takes a deeper look at global trends driving advanced packaging, highlighting applications, today’s technologies and future trends.

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Dow’s Taiwan CMP Team Honored with Occupational Safety and Health Award

Dec 13, 2016

Dow Electronic Materials recently received the 2016 Taiwan Occupational Safety and Health Award for its Asia CMP Manufacturing and Technical Center. Read on for pictures from the award ceremony.

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Dow to Present on the Challenges for Materials at the 14th International System-on-Chip Conference

Oct 05, 2016

At this year’s International System-on-Chip Conference, Dow Electronic Materials will present on the challenges facing SoC manufacturing from a chemistry perspective. Matthew Grandbois, Ph.D., will discuss how SoC devices have emerged to enable the continued evolution of electronic performance beyond what is achievable at 28nm, and Dow’s role in providing materials solutions for this challenging architectural landscape.

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Hear from Dow’s Experts at the ICPT CMP Conference in Beijing

Oct 03, 2016

The International Conference on Planarization/CMP Technology (ICPT) will be held in Beijing, China, October 17-19, 2016. Dow Electronic Materials will be well-represented at this leading CMP conference with session topics on materials and metrology, as well as poster presentations dedicated to some of our newest CMP pad and slurry technology.

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Dow to Present at PRiME 2016: From TSV to Copper Pillars’ Transformative Technology

Sep 27, 2016

The Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) conference brings together leading industry players to discuss a diverse blend of electrochemical and solid-state science and technology. This year, Dow Electronic Materials will present on how TSV and copper pillars are transforming semiconductor advanced packaging technology.

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Peter Trefonas, 2016 Perkin Medal Recipient, Credits Chemistry for Enabling the Information Age

Sep 26, 2016

Peter Trefonas, Ph.D., received the Society of Chemical Industry (SCI) Perkin Medal on September 13, 2016, recognized as the highest honor given for outstanding work in applied chemistry in the United States. At the award ceremony, Trefonas spoke to how chemistry innovations enabled the Information Age.

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Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan

Sep 01, 2016

The complexity of through-silicon via (TSV) geometry has increased the difficulty of global uniformity after the chemical mechanical planarization (CMP) process. At SEMICON Taiwan, Dow’s Michelle Ho, Ph.D., will address this in a presentation, "Expandable and Tunable CMP Slurry Platform for TSV Applications," as part of the CMP Forum on September 7, 2016.

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Semiconductor Manufacturing Technologies from Dow Named Finalists for R&D 100 Awards

Aug 31, 2016

Two Dow technologies used in the process of fabricating integrated circuits have been named finalists in R&D Magazine’s prestigious 2016 R&D 100 Awards. Our CTO™ 2000 Trimming Overcoat enhances the photolithography process while IKONIC™ 4100 Polishing Pads optimize performance for chemical mechanical planarization (CMP).

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Dow’s Rozalia Beica to Present at the SEMICON Taiwan SiP Global Summit

Aug 23, 2016

The SiP Global Summit, which takes place during SEMICON Taiwan, is a two-day workshop devoted to advancements in system-in-package technologies. As part of this year’s novel material and equipment readiness segment of the program, Dow’s Rozalia Beica will tackle the challenges of both embedded technologies and fan-out wafer-level packaging.

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Dow’s Peter Trefonas, Ph.D., to Be Honored with SCI Perkin Medal

Jun 28, 2016

Trefonas will be honored with an SCI Perkin Medal, the highest honor given for outstanding work in applied chemistry. He is being recognized for his expertise in chemistries and materials used in photolithography processes and for creating materials that have enabled production of smaller feature sizes in semiconductor manufacturing.

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Dow Electronic Materials Taiwan Site Holds Groundbreaking Ceremony for Expansion Project

Jun 23, 2016

Dow Taiwan recently hosted a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center to mark the beginning of construction. Dow will increase production capacity of materials for conventional and next-generation chemical mechanical planarization (CMP) pads in a multi-functional building close to the business’ existing facility in Hsinchu Science Park.

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Dow’s Litho Technologies Team Recognized by Fairchild Semiconductor

Jun 20, 2016

Dow Electronic Materials has been recognized as Fairchild Semiconductor's Chemical Supplier of the Year for its materials and service for the microlithography process. The award was recently presented to representatives from Dow’s Litho Technologies team in Marlborough, MA.

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Dow’s Phillip Hustad, Ph.D., Featured in American Chemical Society “What Chemists Do” Series

Jun 14, 2016

Dow's Phillip Hustad, Ph.D., discusses his chemistry career in this video from the American Chemical Society's "What Chemists Do" video series. Watch the video to hear highlights from throughout his career including his graduate studies, his work synthesizing polyethylene at the industrial level, and advice for those getting started in the field.

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Dow Electronic Materials Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

Jun 08, 2016

Advanced semiconductor manufacturing continues to follow the projections of Moore’s Law, making process specifications increasingly stringent with a greater need than ever for defect reduction. In response to these emerging requirements, Dow Electronic Materials recently launched its new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.

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Dow CMP to Present at Inaugural Strategic Materials Conference Korea

May 05, 2016

Dow is honored to participate in the inaugural Strategic Materials Conference Korea. We will discuss the need for advanced CMP materials to achieve scaling as the industry moves below 10 nm, and address the challenges faced by semiconductor materials suppliers for next-generation manufacturing.

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Does Electrodeposited Indium have a Future in Advanced Packaging?

May 04, 2016

Copper (Cu) pillars are important interconnect structures used in advanced IC packaging, requiring cost-effective solder capping materials, and lower bonding temperature is emerging as an important driver. This article provides an overview of “Enabling Low-Temperature Bonding in Advanced Packaging using Electrodeposited Indium,” to be presented at the 2016 ECTC sponsored by IEEE.

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2016 Dow Korea Award Winner Recognized for Work on OLED Efficiency

May 03, 2016

The Dow Korea Award program honors outstanding work in electronic materials to support the research activities of science and engineering students in Korea. This year’s winner, Seoul National University Ph.D. candidate Kwon-Hyeon Kim was recognized for his work on OLED efficiency, demonstrating EQEs of 35.6% with horizontally oriented dipole moments.

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Join Dow at the 2016 Symposium on Polymers for Microelectronics

Apr 14, 2016

Dow Electronic Materials will present some of its latest advances in dielectric materials for advanced packaging at this year’s IMAPS Symposium on Polymers for Microelectronics, taking place in Winterthur, Delaware, April 25-27, 2016. This year’s conference is focused on innovations driving a smart and interconnected world.

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Join Dow at the 2016 IMAPS Device Packaging Conference

Mar 03, 2016

Dow Electronic Materials will be participating in this year’s IMAPS Device Packaging Conference with other industry leaders to move forward a number of advanced packaging technologies. Dow will present two papers in the Interposer and 3D-IC & Packaging track and contribute to a third presented by Fraunhofer IZM.

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Dow’s Litho and CMP Teams to Present at CSTIC 2016

Mar 02, 2016

Dow is a proud participant in this year’s CSTIC conference, where we will present papers about some of our recent work in lithography and chemical mechanical planarization (CMP) technology. The conference will be held March 13-14, 2016 in conjunction with SEMICON China in Shanghai.

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Learn from Dow’s Experts at SPIE Lithography

Jan 26, 2016

The 2016 SPIE Advanced Lithography Conference will be held February 21-25, 2016 in San Jose, CA. The Dow team will be presenting four sessions and one poster presentation as part of the Advances in Patterning Materials and Processes conference track, and we hope to see you there!

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Dow Recognized by TSMC with Supplier Excellence Award for CMP Materials

Dec 17, 2015

Dow Electronic Materials is honored to have received a 2015 Supplier Excellence Award from TSMC for performance in the development and delivery of materials for chemical mechanical planarization (CMP).

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Dow’s SOLDERON™ Tin-Silver Plating Chemistry Takes Home an Oscar of Innovation

Nov 23, 2015

It’s been a banner year for SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry, which was recently awarded an R&D 100 Award, presented by R&D Magazine in a ceremony at Caesar’s Palace in Las Vegas. This “Oscar of Innovation” takes its place in Dow Electronic Materials’ trophy case, next to the 2015 Edison Award.

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Join Dow’s CMP Team at ICPT 2015

Sep 25, 2015

Dow is proud to be a sponsor and participant at the 2015 International Conference on Planarization/CMP Technology (ICPT) taking place in Chandler, Ariz. Sept. 30 to Oct. 2, 2015. This year, we will be giving three presentations during the conference, which are previewed in this short article.

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Three Dow Electronic Materials Technologies Named Finalists for 2015 R&D 100 Awards

Aug 19, 2015

Dow was recently highlighted as a leading innovator with 21 products selected as finalists for the 2015 R&D 100 Awards. Three of these are technologies developed by Dow Electronic Materials as market-focused solutions and commercialized in the last year.

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SOLDERON™ BP TS 6000 Tin-Silver Honored by the Prestigious Edison Awards for Getting the Lead Out

Jul 07, 2015

In common vernacular, “getting the lead out” is a phrase that means, “hurry up!” In the electronics industry, the expression is taken quite literally, with manufacturers needing to find a lead-free alternative to tin-lead solders for wafer bumping processes. Tin-silver plating chemistry has stepped in to fill the role.

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