Dow’s SOLDERON™ Tin-Silver Plating Chemistry Takes Home an Oscar of Innovation

November 23,2015

It’s been a banner year for SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry, which last Friday, November 13, 2015, was awarded an R&D 100 Award, presented by R&D Magazine in a ceremony at Caesar’s Palace in Las Vegas. This “Oscars of Innovation” – as it is known in the R&D world – will take its place in Dow Electronic Materials’ trophy case, right next to the Edison Award that SOLDERON Tin-Silver received in April 2015.

What makes SOLDERON BP TS 6000 Tin-Silver stand out is not only its lead-free, tin-silver composition, but also that it has succeeded in filling the void left by its tin-lead-based predecessor; the ability to ensure device performance and reliability. Ever since the Restriction of Hazardous Substances (RoHS) directive went into effect 11 years ago, the microelectronics industry has struggled with finding a suitable replacement for tin-lead solders for forming critical connections. SOLDERON Tin-Silver does this and more, demonstrating high plating speeds and wide process windows. SOLDERON Tin-Silver doesn’t just plate standard solder bumps – it has been optimized for fine-pitch applications, such as Cu pillars and micro-bumps that are used in 2.5D and 3D-IC packaging technologies.

Learn more about SOLDERON Tin-Silver in this behind-the-scenes interview with Wataru Tachikawa, global marketing manager, Dow Electronic Materials.

 

It’s been a banner year for SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry, which last Friday, November 13, 2015, was awarded an R&D 100 Award, presented by R&D Magazine in a ceremony at Caesar’s Palace in Las Vegas. This “Oscars of Innovation” – as it is known in the R&D world – will take its place in Dow Electronic Materials’ trophy case, right next to the Edison Award that SOLDERON Tin-Silver received in April 2015.

What makes SOLDERON BP TS 6000 Tin-Silver stand out is not only its lead-free, tin-silver composition, but also that it has succeeded in filling the void left by its tin-lead-based predecessor; the ability to ensure device performance and reliability. Ever since the Restriction of Hazardous Substances (RoHS) directive went into effect 11 years ago, the microelectronics industry has struggled with finding a suitable replacement for tin-lead solders for forming critical connections. SOLDERON Tin-Silver does this and more, demonstrating high plating speeds and wide process windows. SOLDERON Tin-Silver doesn’t just plate standard solder bumps – it has been optimized for fine-pitch applications, such as Cu pillars and micro-bumps that are used in 2.5D and 3D-IC packaging technologies.

Learn more about SOLDERON Tin-Silver in this behind-the-scenes interview with Wataru Tachikawa, global marketing manager, Dow Electronic Materials.