Dow CMP to Present at Inaugural Strategic Materials Conference Korea

May 05,2016

Under the theme “A Decade of Materials,” SEMI is bringing its Strategic Materials Conference (SMC) to Korea for the first time, and Dow is honored to participate in this inaugural event. The daylong session will explore how advanced materials are essential for current scaling technology and address the challenges faced by semiconductor materials suppliers.

Taking place from 09:00 to 18:30 on Wednesday, May 18, 2016 in #402, Conference Room (South), COEX, Seoul, speakers from a wide range of companies will present breakthrough technology and market trends for advanced materials.

Under the theme “A Decade of Materials,” SEMI is bringing its Strategic Materials Conference (SMC) to Korea for the first time, and Dow is honored to participate in this inaugural event. The daylong session will explore how advanced materials are essential for current scaling technology and address the challenges faced by semiconductor materials suppliers.

Taking place from 09:00 to 18:30 on Wednesday, May 18, 2016 in #402, Conference Room (South), COEX, Seoul, speakers from a wide range of companies will present breakthrough technology and market trends for advanced materials.

Driven by the need for miniaturization, new materials must be integrated into more complex structures to extend scaling. Complicating things further is the growth in the total number of materials being integrated into advanced device structures. As a result, process complexity increases rapidly—especially in terms of materials interactions—and chemical mechanical planarization (CMP) is no exception to these changing requirements. Dow’s Marty DeGroot, Global R&D Director, CMP Technologies, will discuss innovation in CMP consumables during his presentation titled “CMP Solutions for 10nm and Beyond,” taking place from 13:30 to 14:00.

With the continued reduction of critical dimensions and scaling in three dimensions of microelectronic devices, CMP continues to be a critical and enabling process technology. Advanced logic and 3D memory architectures demand high planarization efficiency for certain critical layers amid increasingly stringent requirements for yield-limiting defects due to feature sizes. For CMP pad materials, planarization efficiency and defectivity typically exhibit an inverse correlation as a function of material hardness. This presentation will provide an overview of recent progress in advanced fundamental understanding of material properties driving planarization, resulting in the development of new pad materials that break conventional trade-offs in planarization and defectivity.

Rounding out Dow’s participation in the event is Bok-Hee Lee, Site Leader for the Dow Seoul Technology Center, who was selected to serve on the conference’s organizing committee. “We are pleased to see SEMI expand the Strategic Materials Conference program to Korea,” she noted. “We look forward to a successful and informative event, as well as to our continued partnership in the region.”