Dow Electronic Materials Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

June 08,2016
Figure 1: OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

As logic and memory chip companies manufacture advanced semiconductor wafers, defect reduction requirements and process specifications become more and more stringent. In response to these emerging requirements, Dow Electronic Materials recently announced the launch of the new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.

Through advanced chemistries and optimized particle concentration, OPTIPLANE CMP slurries deliver a range of tunable removal rates. Selectivities are adjustable to meet unique customer specifications. While enabling excellent planarization efficiency and low defect levels, the dilutable OPTIPLANE CMP slurry platform can also offer improvements in yield and cost of ownership (CoO).

Read the Press Release

Figure 1: OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

As logic and memory chip companies manufacture advanced semiconductor wafers, defect reduction requirements and process specifications become more and more stringent. In response to these emerging requirements, Dow Electronic Materials recently announced the launch of the new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.

Through advanced chemistries and optimized particle concentration, OPTIPLANE CMP slurries deliver a range of tunable removal rates. Selectivities are adjustable to meet unique customer specifications. While enabling excellent planarization efficiency and low defect levels, the dilutable OPTIPLANE CMP slurry platform can also offer improvements in yield and cost of ownership (CoO).

Read the Press Release