Dow’s Rozalia Beica to Present at the SEMICON Taiwan SiP Global Summit

August 23,2016
Rozalia Beica, Global Director, New Business Development, Dow Electronic Materials

The SiP Global Summit, which takes place during SEMICON Taiwan, is a two-day workshop devoted to advancements in system-in-package technologies. Historically, the first day covers advancements in 2.5D and 3D technologies, while day two focuses on embedded and wafer-level packaging. This year, Dow Electronic Materials is honored to be presenting on the second day.

The theme for this year’s Embedded and Wafer Level Packaging Forum is "Innovative Embedded Technology to Enable IoT/Wearable/Mobile Devices." Industry experts will address the competitive landscape of the wearable/mobile market, and provide insights on achieving multifunctional chip integration by either die embedded in the substrate, or in molded fan-in/fan-out packages to achieve desired performance in a thin, and small form factor by focusing on four key areas:

  • Market trends for the wearable/mobile product applications
  • System and application scope
  • Innovative package solutions and challenges
  • Novel materials and equipment readiness

As part of the novel material and equipment readiness segment of the program, Dow’s Rozalia Beica will tackle the challenges of both embedded technologies and fan-out wafer-level packaging during her talk, “Advanced Materials Enabling System in Package Integration through Embedded Technologies.”

Read the presentation abstract  here.

For more information about the agenda and schedule, visit the SiP Global Summit 2016-Embedded and Wafer Level Package Technology Forum site.

Rozalia Beica, Global Director, New Business Development, Dow Electronic Materials

The SiP Global Summit, which takes place during SEMICON Taiwan, is a two-day workshop devoted to advancements in system-in-package technologies. Historically, the first day covers advancements in 2.5D and 3D technologies, while day two focuses on embedded and wafer-level packaging. This year, Dow Electronic Materials is honored to be presenting on the second day.

The theme for this year’s Embedded and Wafer Level Packaging Forum is "Innovative Embedded Technology to Enable IoT/Wearable/Mobile Devices." Industry experts will address the competitive landscape of the wearable/mobile market, and provide insights on achieving multifunctional chip integration by either die embedded in the substrate, or in molded fan-in/fan-out packages to achieve desired performance in a thin, and small form factor by focusing on four key areas:

  • Market trends for the wearable/mobile product applications
  • System and application scope
  • Innovative package solutions and challenges
  • Novel materials and equipment readiness

As part of the novel material and equipment readiness segment of the program, Dow’s Rozalia Beica will tackle the challenges of both embedded technologies and fan-out wafer-level packaging during her talk, “Advanced Materials Enabling System in Package Integration through Embedded Technologies.”

Read the presentation abstract  here.

For more information about the agenda and schedule, visit the SiP Global Summit 2016-Embedded and Wafer Level Package Technology Forum site.