Dow to Present at Inaugural Electron Devices Technology and Manufacturing Conference

February 09,2017
Dow’s Rozalia Beica to present on Advanced Materials and Interconnect Technologies for Next-Generation Smart Devices at EDTM

In 2017, a new conference joins the roster of semiconductor industry key events held in Asia, prompted by the increased interest and awareness in system integration as a solution to improved device performance. As highlighted by the conference organizing team, the Asia-Pacific region is well-positioned to take the initiative in this effort. As such, the inaugural Electron Devices Technology and Manufacturing (EDTM) Conference, sponsored by the IEEE Electron Devices Society (EDS) will take place from February 28 to March 2 in Toyama, Japan.

The mission of EDTM is to foster collaboration to overcome the increasing technology scaling challenges through system integration solutions. The conference serves as a forum for the electron devices community to collaborate on topics ranging from devices, materials and tools to create new and innovative technologies. Dow will be represented by Rozalia Beica, global director of new business development for Dow Electronic Materials, who will deliver an invited presentation, "Advanced Materials and Interconnect Technologies for Next-Generation Smart Devices." Here is an excerpt of the presentation abstract:

The rapid evolution of mobile applications has propelled the smartphone to become dominant in the industry, not only because of the high growth in units, but also in the advancements achieved in development of semiconductor and packaging technologies. The Internet of Things (IoT) will further enhance the application of smartphones, making it a hub of connected devices that have the promise of making the environment around us smarter and safer. The next generation of smart devices will require an increased number of sensors and wireless devices to be incorporated in smaller and higher performance products while cost pressure continues.

Check out the full conference program here.

Dow’s Rozalia Beica to present on Advanced Materials and Interconnect Technologies for Next-Generation Smart Devices at EDTM

In 2017, a new conference joins the roster of semiconductor industry key events held in Asia, prompted by the increased interest and awareness in system integration as a solution to improved device performance. As highlighted by the conference organizing team, the Asia-Pacific region is well-positioned to take the initiative in this effort. As such, the inaugural Electron Devices Technology and Manufacturing (EDTM) Conference, sponsored by the IEEE Electron Devices Society (EDS) will take place from February 28 to March 2 in Toyama, Japan.

The mission of EDTM is to foster collaboration to overcome the increasing technology scaling challenges through system integration solutions. The conference serves as a forum for the electron devices community to collaborate on topics ranging from devices, materials and tools to create new and innovative technologies. Dow will be represented by Rozalia Beica, global director of new business development for Dow Electronic Materials, who will deliver an invited presentation, "Advanced Materials and Interconnect Technologies for Next-Generation Smart Devices." Here is an excerpt of the presentation abstract:

The rapid evolution of mobile applications has propelled the smartphone to become dominant in the industry, not only because of the high growth in units, but also in the advancements achieved in development of semiconductor and packaging technologies. The Internet of Things (IoT) will further enhance the application of smartphones, making it a hub of connected devices that have the promise of making the environment around us smarter and safer. The next generation of smart devices will require an increased number of sensors and wireless devices to be incorporated in smaller and higher performance products while cost pressure continues.

Check out the full conference program here.