Dow Weighs in on the Heterogeneous Integration Roadmap for 2017

February 21,2017
Dow's Rob Kavanagh comments on the roadmap for heterogeneous integration in semiconductor manufacturing.

The annual request for semiconductor industry outlooks came in from 3D InCites this year with some fairly specific requests. Companies were asked to consider the continued consolidation of the semiconductor manufacturing industry as a whole; the retirement of the International Technology Roadmap for Semiconductors (ITRS) based on Moore's law and a new initiative for a Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS); the need for collaboration across the supply chain; and the driving force of the Internet of Things to produce more MEMS and sensor-based technology.  How will all these changes impact your company over the next year?

Rob Kavanagh, Global Business Director, Advanced Packaging Technologies, weighed in for Dow as a voice for the future of this exciting market segment and on the role and impact it will have on the HITRS.

“Dow has joined and is actively supporting the activities of HITRS, through participation at face-to-face meetings and workshops around the world, in addition to giving our insights into process integration and material needs to address industry challenges, projecting trends and roadmapping,” wrote Kavanagh. He went on to provide a retrospective of the ITRS, talked about the importance of becoming involved in industry roadmapping activities and the value of industry roadmaps as whole, and highlighted some differences between the drivers of the ITRS vs. the new HITRS. He says he is excited about the pivotal role advanced packaging technologies will play in this next phase of our industry’s innovation. Check out Rob’s full outlook piece here on 3D InCites.

Dow's Rob Kavanagh comments on the roadmap for heterogeneous integration in semiconductor manufacturing.

The annual request for semiconductor industry outlooks came in from 3D InCites this year with some fairly specific requests. Companies were asked to consider the continued consolidation of the semiconductor manufacturing industry as a whole; the retirement of the International Technology Roadmap for Semiconductors (ITRS) based on Moore's law and a new initiative for a Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS); the need for collaboration across the supply chain; and the driving force of the Internet of Things to produce more MEMS and sensor-based technology.  How will all these changes impact your company over the next year?

Rob Kavanagh, Global Business Director, Advanced Packaging Technologies, weighed in for Dow as a voice for the future of this exciting market segment and on the role and impact it will have on the HITRS.

“Dow has joined and is actively supporting the activities of HITRS, through participation at face-to-face meetings and workshops around the world, in addition to giving our insights into process integration and material needs to address industry challenges, projecting trends and roadmapping,” wrote Kavanagh. He went on to provide a retrospective of the ITRS, talked about the importance of becoming involved in industry roadmapping activities and the value of industry roadmaps as whole, and highlighted some differences between the drivers of the ITRS vs. the new HITRS. He says he is excited about the pivotal role advanced packaging technologies will play in this next phase of our industry’s innovation. Check out Rob’s full outlook piece here on 3D InCites.