IMAPS Device Packaging Conference to Feature Next-Gen Materials and Trends

February 28,2017
2017 IMAPS Device Packaging Conference

Heterogeneous integration, 3D ICs, interposers, fan-out wafer-level packaging (FOWLP), MEMS, sensors and embedded components are the hot technologies. Automotive electronics, the internet of things (IoT) and 5G are the big drivers. Growth in China and the changing back-end landscape are industry trends to watch.

All of this and more provide the topics for discussion in five keynotes, numerous sessions and a panel discussion during the co-located 13th Annual IMAPS Device Packaging Conference and Global Business Council meeting March 6-9, at We-Ko-Pa Resort and Conference Center in Fountain Hills, Arizona.

Dow Electronic Materials is honored to have its experts featured at two events on Wednesday, March 8. Mark your calendars and be on the lookout for the following presentations:

Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices
Eric Huenger, Rozalia Beica, Dow Electronic Materials

Global Business Council Plenary Session
Wednesday, March 8, 2017, 10:45-11:15 a.m.

The presentation provides an overview of the global trends driving the growth of advanced packaging, highlighting the trends of packaging platforms and substrates seen today in mobile applications. An overview of the various materials and interconnect processes required at the wafer and printed circuit board/substrate levels, across various packaging platforms (wafer-level packaging, system-in-package, 3D IC) will be included, highlighting current industry challenges and the solutions that Dow Electronic Materials is bringing to enable current and future development of smart devices.

Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies
Rosemary Bell, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, Mark Scalisi, Yi Qin, Yun-Hyeon Kim, Wataru Tachikawa, Yoon Joo Kim, Mark Lefebvre, Jeff Calvert

IMAPS DPC WP1: 3D Applications and Materials Session
Wednesday, March 8, 2017, 2:30-3:00 p.m.

Today’s advanced packaging technologies require photoresist materials that allow for better pattern resolution because of challenging device architectures. Additionally, device throughput can be increased with imaging materials that have higher sensitivity and metallization chemistries with faster electrodeposition rates. The integration of photoimaging materials and subsequent plating chemistry is essential for producing metallized structures for redistribution layers, micropillar and fan-out applications. This presentation will showcase a chemically amplified material developed by Dow, that when integrated with INTERVIA™ Cu 8540 Electroplating Copper Chemistry, NIKAL™ BP Ni plating chemistry and SOLDERON™ BP TS 6000 SnAg plating chemistry, demonstrates compatibility and provides superior performance for advanced packaging technologies.

Interested in other advanced packaging trends? Check out Rozalia Beica and Monita Pau’s recent post “Will Fan-out Panel-Level Packaging Really Happen?

2017 IMAPS Device Packaging Conference

Heterogeneous integration, 3D ICs, interposers, fan-out wafer-level packaging (FOWLP), MEMS, sensors and embedded components are the hot technologies. Automotive electronics, the internet of things (IoT) and 5G are the big drivers. Growth in China and the changing back-end landscape are industry trends to watch.

All of this and more provide the topics for discussion in five keynotes, numerous sessions and a panel discussion during the co-located 13th Annual IMAPS Device Packaging Conference and Global Business Council meeting March 6-9, at We-Ko-Pa Resort and Conference Center in Fountain Hills, Arizona.

Dow Electronic Materials is honored to have its experts featured at two events on Wednesday, March 8. Mark your calendars and be on the lookout for the following presentations:

Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices
Eric Huenger, Rozalia Beica, Dow Electronic Materials

Global Business Council Plenary Session
Wednesday, March 8, 2017, 10:45-11:15 a.m.

The presentation provides an overview of the global trends driving the growth of advanced packaging, highlighting the trends of packaging platforms and substrates seen today in mobile applications. An overview of the various materials and interconnect processes required at the wafer and printed circuit board/substrate levels, across various packaging platforms (wafer-level packaging, system-in-package, 3D IC) will be included, highlighting current industry challenges and the solutions that Dow Electronic Materials is bringing to enable current and future development of smart devices.

Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies
Rosemary Bell, Joseph Lachowski, Mitsuru Haga, Inho Lee, Regina Cho, Matthew Thorseth, Jonathan Prange, Mark Scalisi, Yi Qin, Yun-Hyeon Kim, Wataru Tachikawa, Yoon Joo Kim, Mark Lefebvre, Jeff Calvert

IMAPS DPC WP1: 3D Applications and Materials Session
Wednesday, March 8, 2017, 2:30-3:00 p.m.

Today’s advanced packaging technologies require photoresist materials that allow for better pattern resolution because of challenging device architectures. Additionally, device throughput can be increased with imaging materials that have higher sensitivity and metallization chemistries with faster electrodeposition rates. The integration of photoimaging materials and subsequent plating chemistry is essential for producing metallized structures for redistribution layers, micropillar and fan-out applications. This presentation will showcase a chemically amplified material developed by Dow, that when integrated with INTERVIA™ Cu 8540 Electroplating Copper Chemistry, NIKAL™ BP Ni plating chemistry and SOLDERON™ BP TS 6000 SnAg plating chemistry, demonstrates compatibility and provides superior performance for advanced packaging technologies.

Interested in other advanced packaging trends? Check out Rozalia Beica and Monita Pau’s recent post “Will Fan-out Panel-Level Packaging Really Happen?