Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference

October 16,2017

Building on last year’s focus on the development of a smart, connected world, this year’s theme, “IMPACT on Intelligent Everything,” will dive deep into future technology trends for smart applications, robots, drones, autonomous vehicles, artificial intelligence and IoT devices. Held in conjunction with TPCA SHOW 2017, the International Microsystems, Packaging Assembly and Circuits Technology (IMPACT) conference, organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of IC packaging and printed circuit board (PCB) professionals in Taiwan.

IMPACT’s robust agenda features plenary speeches, special sessions, invited talks, industrial sessions, posters and paper presentations on topics related to accelerating manufacturing and commercialization of intelligent things.

Dow Electronic Materials’ experts are once again honored to join the ranks of renowned researchers and academia participating at IMPACT 2017. The company will present its latest research findings and process breakthroughs related to eliminating tin whiskers in PCB manufacturing and meeting the requirements for ever-tightening features sizes for high-density interconnect (HDI) applications. During the conference, Dow scientists will present the following two papers:

Studies on Tin Whisker Growth under High External Pressure
Oct. 25, 4 p.m., Session S8
Topic: Electrodeposition and Electrochemical Processing Technology

Tin whiskers that form due to lead-free electronic component manufacturing processes have long been an industry challenge, particularly when implementing press-fit approaches for forming reliable solderless electronic joints. Press-fit technology allows for the insertion of a press-fit pin (male) into a plated-through hole (PTH, female) in a PCB to establish cold-welded interconnections without using solder. However, the press-fit process lends itself to tin-whisker formation, thereby threatening the reliability of the joint and making it susceptible to electrical short-circuit. The study being presented by Flora He, Senior Scientist at Dow Electronic Materials, reveals contributing factors to tin whisker formation, paving the way for methods to mitigate whisker growth.

A Novel Electroplating Technology with Leveling, Minimum Surface Deposition for HDI Applications
Oct. 27, 1:40 p.m., Session S25
Topic: Electrodeposition and Electrochemical Processing Technology

Today’s HDIs rely on electrolytic copper micro via filling to achieve the ever-shrinking geometries required to manufacture smaller, higher-performance electronics devices. Growing requirements for high-density circuits with improved transmission efficiency and signals disturbing resistance means void-free copper fill processes must be achieved without skip plating, while maintaining production-level plating rates. In this presentation, Dow’s Pei-Jung Wu will describe factors affecting copper electroplating for micro via filling, and how this led to the development of a new plating formulation with great surface leveling, resulting in thinner copper deposit thickness for direct current copper process for HDI applications.

The 2017 IMPACT conference will take place Oct. 25-27, 2017 in Taipei, Taiwan. In addition to our conference presentations, we welcome you to explore our recently expanded product offering in the Dow Electronic Materials and DuPont Electronic Materials joint booth #K619 at the related TPCA Show.

For more information on IMPACT 2017 and to register, visit the website.