Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan

September 01,2016

The CMP Forum is a half-day program during SEMICON Taiwan, organized by the Chemical Mechanical Planarization User Group Taiwan (CMPUGTW). This year’s event will be held on Wednesday, September 7, with the theme "CMP for Integrated IC Devices and System."

This year’s program places an emphasis on the innovations needed in CMP process and precision control in order to enable 10nm and sub 10nm manufacturing. The forum will bring together international experts to discuss topics including materials, process control and metrology.

Dow’s Michelle Ho, Ph.D., will be presenting on the topic "Expandable and Tunable CMP Slurry Platform for TSV Applications" from 2:40 - 3:10 p.m. Dr. Michelle Ho is a Slurry R&D Scientist in Dow Electronic Materials, based at Dow’s Asia CMP Manufacturing and Technical Center in Taiwan.

Through-silicon via (TSV) is a vertical electrical interconnect technology, allowing 3D ICs to pack various functionalities into a small form factor. The complexity of TSV geometry has increased the difficulty of global uniformity after the CMP process.

In her talk, Dr. Ho will discuss Dow’s expandable and tunable CMP slurry platforms that have been designed to meet unique requirements of TSV CMP applications. Based on the technology of abrasives and performing additives, Dow’s slurries provide good stability, low defectivity and customizable removal rates and selectivities. These slurries have been adopted for various film stacks and/or product integrations.

In addition, be on the lookout for a session from Dow’s Rozalia Beica, who will present "Advanced Materials Enabling System in Package Integration through Embedded Technologies" as part of the SiP Global Summit on Friday, September 9. Rozalia Beica is Global Director of New Business Development for Dow Electronic Materials.

The CMP Forum is a half-day program during SEMICON Taiwan, organized by the Chemical Mechanical Planarization User Group Taiwan (CMPUGTW). This year’s event will be held on Wednesday, September 7, with the theme "CMP for Integrated IC Devices and System."

This year’s program places an emphasis on the innovations needed in CMP process and precision control in order to enable 10nm and sub 10nm manufacturing. The forum will bring together international experts to discuss topics including materials, process control and metrology.

Dow’s Michelle Ho, Ph.D., will be presenting on the topic "Expandable and Tunable CMP Slurry Platform for TSV Applications" from 2:40 - 3:10 p.m. Dr. Michelle Ho is a Slurry R&D Scientist in Dow Electronic Materials, based at Dow’s Asia CMP Manufacturing and Technical Center in Taiwan.

Through-silicon via (TSV) is a vertical electrical interconnect technology, allowing 3D ICs to pack various functionalities into a small form factor. The complexity of TSV geometry has increased the difficulty of global uniformity after the CMP process.

In her talk, Dr. Ho will discuss Dow’s expandable and tunable CMP slurry platforms that have been designed to meet unique requirements of TSV CMP applications. Based on the technology of abrasives and performing additives, Dow’s slurries provide good stability, low defectivity and customizable removal rates and selectivities. These slurries have been adopted for various film stacks and/or product integrations.

In addition, be on the lookout for a session from Dow’s Rozalia Beica, who will present "Advanced Materials Enabling System in Package Integration through Embedded Technologies" as part of the SiP Global Summit on Friday, September 9. Rozalia Beica is Global Director of New Business Development for Dow Electronic Materials.