Since its beginnings as the 3D TSV Summit in 2013, the European 3D Summit, hosted by SEMI Europe and held each January at Minatec Campus in Grenoble, France, has evolved along with the emergence of 2.5D and 3D packaging technologies, and has thus become one of the most comprehensive and relevant 3D conferences, drawing well over 200 attendees representing the global advanced packaging community.
This year’s edition, which takes place Jan. 23-25, 2017, is themed: Creating High-Density Systems, and explores a wider scope of 3D topics including 3D IC through silicon via (TSV) technology and its challenges, as well as 2.5D, 3D fan-out wafer-level packaging (FOWLP), glass interposers, and 3D alternative technologies to create heterogeneous integration and high-density systems for different applications. Particular emphasis will be given to 3D applications and future technologies.
In keeping with this theme, global director of new business development for Dow Electronic Materials, Rozalia Beica, is on the roster Wednesday, Jan. 25 to deliver a presentation during Session 7, “What Are the Future 3D Technologies?” titled “Advanced Integrated Packaging Solutions for Next-Generation Smart Devices.” Here is an excerpt from the presentation abstract:
The presentation provides an overview of the global trends driving advanced packaging growth, highlighting applications, the different technologies available today, as well as future trends. Since materials and processing plays an important role in the successful development and adoption of new manufacturing technologies, the ability to deliver high-performing, integrated materials with flexible processing capabilities is critical. An overview of the materials and processes needs across various packages is included, highlighting current industry challenges and the solutions that Dow Electronic Materials is bringing to address those challenges and enable future development of smart devices.
Check out the full conference program here.