Semiconductor Manufacturing Technologies from Dow Named Finalists for R&D 100 Awards

August 31,2016

Presented by R&D Magazine, the R&D 100 Awards are one of the highest honors in the research and design community. Each year, the top 100 breakthrough innovations are selected by an elite panel of professional consultants, university faculty, and industrial researchers. Dow Electronic Materials is proud to announce that two of our technologies for semiconductor manufacturing have been named finalists for the 2016 awards: CTO™ 2000 Trimming Overcoat for microlithography and IKONIC™ 4100 Polishing Pads for chemical mechanical planarization.

“Our research and development work for the semiconductor market is always guided by the needs of our customers. Both CTO™ 2000 and IKONIC™ 4100 were developed to help our customers with increasingly complex manufacturing requirements for next-generation computer chips,” said Cathie Markham, global R&D director for Dow Electronic Materials. “Dow’s innovations play a role in making tomorrow’s electronics smaller, faster and more reliable. It is a great honor to see two of these technologies recognized as finalists for the R&D 100 Awards.”

CTO™ 2000 Trimming Overcoat is a spin-on photoresist trim overcoat, a chemical post-treatment that creates smaller features on silicon wafers than photolithography can do alone. It is used in the semiconductor manufacturing process after conventional photolithography to reduce feature size, enabling improved chip performance. In addition to trimming critical dimensions, this overcoat also removes defects after the lithography process by trimming them away chemically. CTO 2000 breaks the trend of requiring new capital investments to go to smaller sizes, allowing existing equipment to pattern smaller than ever thought possible.

IKONIC™ 4100 Polishing Pads are a series of polishing pads for chemical mechanical planarization/polishing (CMP), optimized for performance in the fabrication of integrated circuits in the most advanced Logic and Memory technology nodes. IKONIC 4100 series pads are in use in extremely sensitive CMP processes, including shallow trench isolation (STI), contact etch stop layer (CESL), self-aligned contacts (SAC), Tungsten-gate, Tungsten-plug, interlayer dielectric (ILD), and Copper interconnect polishing. These sophisticated pads demonstrate significantly lower defects in multiple polishing applications without compromising other performance metrics.

"This was a very strong year for research and development across various markets, led by many outstanding technologies that broadened the scope of innovation,” said R&D Magazine Editor Anna Spiewak. “We are honored to recognize these products and the project teams behind the design, development, testing, and production of these remarkable innovations and their impact in the field. We look forward to celebrating all of these achievements in Washington, D.C., in November.”

The 2016 R&D 100 Award winners will be announced on November 3, 2016, at a special ceremony held as part of the R&D 100 Conference. With a total of 15 finalists this year, Dow has been once more highlighted as a leading innovator, and a number of representatives from Dow will be in attendance for this prestigious event.

Presented by R&D Magazine, the R&D 100 Awards are one of the highest honors in the research and design community. Each year, the top 100 breakthrough innovations are selected by an elite panel of professional consultants, university faculty, and industrial researchers. Dow Electronic Materials is proud to announce that two of our technologies for semiconductor manufacturing have been named finalists for the 2016 awards: CTO™ 2000 Trimming Overcoat for microlithography and IKONIC™ 4100 Polishing Pads for chemical mechanical planarization.

“Our research and development work for the semiconductor market is always guided by the needs of our customers. Both CTO™ 2000 and IKONIC™ 4100 were developed to help our customers with increasingly complex manufacturing requirements for next-generation computer chips,” said Cathie Markham, global R&D director for Dow Electronic Materials. “Dow’s innovations play a role in making tomorrow’s electronics smaller, faster and more reliable. It is a great honor to see two of these technologies recognized as finalists for the R&D 100 Awards.”

CTO™ 2000 Trimming Overcoat is a spin-on photoresist trim overcoat, a chemical post-treatment that creates smaller features on silicon wafers than photolithography can do alone. It is used in the semiconductor manufacturing process after conventional photolithography to reduce feature size, enabling improved chip performance. In addition to trimming critical dimensions, this overcoat also removes defects after the lithography process by trimming them away chemically. CTO 2000 breaks the trend of requiring new capital investments to go to smaller sizes, allowing existing equipment to pattern smaller than ever thought possible.

IKONIC™ 4100 Polishing Pads are a series of polishing pads for chemical mechanical planarization/polishing (CMP), optimized for performance in the fabrication of integrated circuits in the most advanced Logic and Memory technology nodes. IKONIC 4100 series pads are in use in extremely sensitive CMP processes, including shallow trench isolation (STI), contact etch stop layer (CESL), self-aligned contacts (SAC), Tungsten-gate, Tungsten-plug, interlayer dielectric (ILD), and Copper interconnect polishing. These sophisticated pads demonstrate significantly lower defects in multiple polishing applications without compromising other performance metrics.

"This was a very strong year for research and development across various markets, led by many outstanding technologies that broadened the scope of innovation,” said R&D Magazine Editor Anna Spiewak. “We are honored to recognize these products and the project teams behind the design, development, testing, and production of these remarkable innovations and their impact in the field. We look forward to celebrating all of these achievements in Washington, D.C., in November.”

The 2016 R&D 100 Award winners will be announced on November 3, 2016, at a special ceremony held as part of the R&D 100 Conference. With a total of 15 finalists this year, Dow has been once more highlighted as a leading innovator, and a number of representatives from Dow will be in attendance for this prestigious event.