The 23rd Guangzhou International Lighting Exhibition (GILE) was held June 9-12, 2018, at the China Import and Export Fair Complex in Guangzhou, China. At the show, Dow Display Technologies (DT) Specialty Silicones Team exhibited solutions for chip-scale packaging (CSP), including material for film encapsulation, as well as a liquid process-based solution called CL-1000 Optical Binder. To take advantage of this high-profile event and gain market attention and interest, Dow also introduced at GILE its new OE-7666 Optical Encapsulant targeting middle power PLCC-type LED packages with increased power to accommodate higher photo-thermal density.
In participating at GILE, the team continued to communicate Dow’s focus on LED packaging applications, as well as our commitment to lead this market with innovation under the Dow Corning brand.
Joe Reiser, DT Specialty Silicones business leader, attended GILE to meet with major customers in China and Korea and assure them of our continued commitment to work with key customers to further explore value in the LED packaging market. With more than 2,000 exhibiting companies and over 150,000 visitors annually, GILE is one of the world’s largest lighting shows, and Asia’s most influential and comprehensive lighting and LED event.
Dow Display Technologies Specialty Silicones
Team had a dynamic presence at GILE 2018, exhibiting to attendees
its solutions for chip-scale packaging (CSP), including material for
film encapsulation, a liquid process-based solution called CL-1000
Optical Binder, and the new OE-7666 Optical Encapsulant for middle