Dow Electronic Materials Taiwan Site Holds Groundbreaking Ceremony for Expansion Project

June 23,2016

On June 21, 2016, Dow Electronic Materials hosted a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center in Taiwan. The event marked the beginning of construction on a significant expansion project to increase production capacity for materials for chemical mechanical planarization (CMP).

Mario Stanghellini, Vice President and Global Business Director, CMP Technologies, 
Dow Electronic Materials, welcomes all guests to the Asia CMP Manufacturing and Technical Center.

This expansion will be the fourth phase of development for the site, introducing a new multi-functional building to the business’ existing facility in Hsinchu Science Park’s Jhunan Campus. The new space will be used primarily to increase manufacturing capacity for both conventional and next-generation CMP pads.

“The semiconductor manufacturing industry continues to see strong growth in Asia. We established this facility in Taiwan to be close to our customers in this growing, leading-edge market,” said Dennis Chen, South Asia Business Director, CMP Technologies, Dow Electronic Materials. “The expansion will allow our CMP teams to build on our close collaboration with customers throughout Asia and ensure our local supply chain.”

Dennis Chen, South Asia Business Director, CMP Technologies, Dow Electronic Materials, introduces the honored guests who will participate in the groundbreaking ceremony.

The event was well attended, with local officials, customers, suppliers, and Dow leaders from throughout the region participating in the ceremony. In addition to the groundbreaking ceremony, attendees were invited on tours of the existing facility and saw renderings of the future building.

“We were greatly honored by the presence of all our guests who attended the groundbreaking event,” said Cliff Chen, Dow’s Hsinchu Site Leader. “This investment builds on our partnerships throughout the region, and our guests were witnesses as we blessed the project’s success and our shared future.”

Dow Electronic Materials held a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center on June 21, 2016. Invited guests included Cliff Chen, Dow Electronic Materials Hsinchu Site Leader (on left); Deputy Director General Leuof the Industrial Development Bureau in the Ministry of Economic Affairs (third from left); Mario Stanghellini, Vice President and Global Business Director, CMP Technologies, Dow Electronic Materials (fifth from left); Dr. Jim Fahey, President, Dow Electronic Materials (sixth from left); Magistrate Hsu of Miaoli County (seventh from left), Yoke Loon Lim, Greater China President, The Dow Chemical Company (eighth from left); Director General Tu of the Hsinchu Science Park Bureau in the Ministry of Science and Technology (tenth from left) and Dennis Chen, South Asia Business Director, CMP Technologies, Dow Electronic Materials (on right).

This year is a momentous one for the Taiwan site in another way as well: In December 2016, employees will celebrate the 10th anniversary of the site.

Read the Press Release (Release also available   in Traditional Chinese)