Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Examining Unique Plating Challenges of TSVs

Jan 17, 2017

This tutorial examines the concept of copper (Cu) through silicon via (TSV) electroplating, which, when done optimally, increases reliability and decreases cost of subsequent process steps.

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Copper Pillar Electroplating Tutorial

Dec 08, 2016

This tutorial examines the requirements and processing considerations for electroplated copper pillars used in advanced chip packaging applications. The key aspects of the plating process and the role of each in achieving the desired design and performance goals are described.

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Copper Electroplating Fundamentals

Nov 22, 2016

This tutorial examines the concept of copper electroplating and how the process works. It also discusses its use in advanced packaging applications like the dual damascene process, TSV, copper pillars, and copper RDL, as well as how feature geometry as well as plating time affect how additives behave.

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The State of EUV Lithography: A Materials Primer

Jul 19, 2016

Extreme ultraviolet (EUV) lithography is the most promising of the post-optical lithography patterning technologies to enable continued shrink, keeping the semiconductor industry on the path of Moore’s law. Dow’s two Litho University℠ video tutorials on EUV are a great place to start learning the fundamentals of EUV technology.

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Enhancing Advanced PCB Performance with Corrosion-Resistant Electroless Nickel

May 24, 2016

PCBs are shipped with a “final finish,” a solderable surface that offers excellent electrical and mechanical connections to IC packages. This tutorial examines current technology, including OSP, ENIG, and immersion tin and silver, and demonstrates how high-phos electroless nickel helps meet the needs of the most advanced PCBs powering today’s electronic devices.

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Litho UniversitySM: Directed Self-Assembly 101

Jul 07, 2015

Nanotechnology researchers have been studying self-assembly to enable development of next-generation electronic devices, and directed self-assembly (DSA) is actively being explored for use in the lithography process of semiconductor manufacturing. In this series of videos, Dow’s Dr. Phil Hustad will take you on a journey through the amazing world of DSA.

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