2017 Outlook: Fan-out Wafer Level Packaging Goes Mainstream

January 13,2017

As the new year kicks off, the industry is looking ahead at expectations and challenges. Dow’s Rob Kavanagh, Global Business Director, Advanced Packaging Technologies, is offering his views from a packaging perspective on what’s coming in the semiconductor manufacturing market.

Rob recently provided his outlook for 2017 in Semiconductor Packaging News, where he pointed to continued growth widely anticipated for the advanced packaging segment that will build off the developments of 2016, particularly in fan-out wafer level packaging (FOWLP). The start of the 2016 FOWLP story was led primarily by the revelation from a number of device analysts that the Apple A10 processor in the new iPhone 7 is indeed built using TSMC’s integrated fan-out (InFO) technology. Even before the predictions were confirmed, market analysts were adjusting their forecasts for FOWLP up in anticipation of this fact.

Now that FOWLP has established its potential as mainstream platform, we are focusing on the industry efforts to broaden the fan-out platform and on addressing the materials challenges. To read more about this turn of events, check out Rob’s full outlook recently published in Semiconductor Packaging News.

Rob recently provided his outlook for 2017 in Semiconductor Packaging News, where he pointed to continued growth widely anticipated for the advanced packaging segment that will build off the developments of 2016, particularly in fan-out wafer level packaging (FOWLP). The start of the 2016 FOWLP story was led primarily by the revelation from a number of device analysts that the Apple A10 processor in the new iPhone 7 is indeed built using TSMC’s integrated fan-out (InFO) technology. Even before the predictions were confirmed, market analysts were adjusting their forecasts for FOWLP up in anticipation of this fact.

Now that FOWLP has established its potential as mainstream platform, we are focusing on the industry efforts to broaden the fan-out platform and on addressing the materials challenges. To read more about this turn of events, check out Rob’s full outlook recently published in Semiconductor Packaging News.