Advanced Packaging Materials Adding More Value to ICs

January 22,2016

Advanced packaging, including fan-out wafer-level packaging (FOWLP) and 3D stacking, now provides an increasing value-add in IC products for mobile markets and pending IoT devices. In the January issue of SST, Rob Kavanagh, Global Business Director of Advanced Packaging Technologies at Dow Electronic Materials looks at recent trends in semiconductor packaging and discusses how electronic materials for advanced packaging will continue to add more value for our global industry.

Read the full outlook as published in Solid State Technology.

Rob Kavanagh, Global Business Director, Advanced Packaging Technologies