2017 Outlook: Semiconductor Market Forecast Calls for Continued Collaboration

February 16,2017

Industry analysts are anticipating a strong year for the global semiconductor market. To learn more about where the industry is headed in 2017, including what is driving the market and what changes we might see, many experts are being asked to share their thoughts. Dow’s Colin Cameron, Global Pads Business Director for CMP Technologies, contributed to a recent outlook published in Solid State Technology, bringing perspectives from the chemical mechanical polishing/planarization (CMP) consumables space. You can also hear from Dow leaders in related markets by looking for the “2017 Outlook” heading in other recent Connectivity posts.

In his editorial, Cameron comments on some of the end markets that are driving semiconductor growth and the enabling technologies behind them. For instance, advanced storage applications such as servers and solid state drives (SSDs) are contributing to growth in advanced chips and opening new uses for 3D NAND flash memory. A common theme he hones in on is how the increasing need for customized solutions has led to increased collaboration between semiconductor manufacturers and materials suppliers. The value in such a collaboration has been witnessed through the successful implementation of 10nm advanced Logic processes, and will continue to be essential for success at future nodes.

Dow’s CMP Technologies business has been preparing for emerging industry needs by collaborating with customers to develop CMP solutions that offer performance benefits for future technology requirements as well as cost of ownership benefits for mature nodes. To learn more, read  Cameron’s editorial in Solid State Technology.

In his editorial, Cameron comments on some of the end markets that are driving semiconductor growth and the enabling technologies behind them. For instance, advanced storage applications such as servers and solid state drives (SSDs) are contributing to growth in advanced chips and opening new uses for 3D NAND flash memory. A common theme he hones in on is how the increasing need for customized solutions has led to increased collaboration between semiconductor manufacturers and materials suppliers. The value in such a collaboration has been witnessed through the successful implementation of 10nm advanced Logic processes, and will continue to be essential for success at future nodes.

Dow’s CMP Technologies business has been preparing for emerging industry needs by collaborating with customers to develop CMP solutions that offer performance benefits for future technology requirements as well as cost of ownership benefits for mature nodes. To learn more, read  Cameron’s editorial in Solid State Technology.