Dow’s polishing pad portfolio sets the standard for chemical mechanical planarization (CMP) in semiconductor manufacturing. Our wide range of hard and soft CMP pads are designed to meet the distinct needs of each different CMP application and technology node. In addition, our technical team has a robust understanding of CMP fundamentals, including product and process development capabilities. We can talk to you about what CMP pad will best meet your particular needs, and we’d also welcome the opportunity to help enhance your overall process!
Click on the pad family links below to learn more about the benefits and target applications for each series.
The IKONIC™ CMP pad series is a breakthrough pad platform designed for multiple applications and advanced nodes. Dow’s latest CMP polishing pad technology combines a range of pad hardness and varying levels of porosity with a pad surface that is easy to condition. The IKONIC™ pad platform is designed to reduce wafer defects and improve removal rate, topography and cost of ownership.
The VISIONPAD™ CMP pad series is a platform designed for multiple applications and advanced nodes. VISIONPAD™ technology is engineered with unique polymer chemistry, including optimized pore size and porosity levels. This leads to a range of polishing performance options depending on process requirements.
The IC1000™ polishing pad series is the industry standard for CMP pads. Dow’s IC1000™ pads are used in a wide variety of CMP applications. While the IC1000™ formulation has remained constant, the quality and consistency of the product offerings have been improved continuously for over 20 years. Popular pads in this family include the IC1000™ CMP pad and the IC1010™ CMP pad.
The OPTIVISION™ PRO CMP pad series is Dow’s third generation soft pad manufactured on a new platform that facilitates advanced polishing and is designed for improvements in cost of ownership.
The OPTIVISION™ CMP pad series is Dow’s second generation soft pad that improves on the performance of POLITEX™ and is designed for improvements in cost of ownership.
The POLITEX™ CMP pad series is used for Copper barrier, buffing and cleaning applications.
Dow's SUBA™ pads are polishing pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics. The SUBA™ family of polishing pad products is the industry standard for silicon stock removal polishing. They may also be used as a sub-pad.
Our CMP pads cover a wide range of applications and technology nodes. For help understanding which technologies are well-suited for different CMP applications, please refer to the following chart.
|Copper Bulk Polishing||IKONIC™ 3040M, 4121H, 4250H
VISIONPAD™ 6000, 7480, 9280
|Cu Barrier Polishing||IKONIC™ 2010H, 2020H, 2040H, 2060H
VISIONPAD™ 3100, 3500
OPTIVISION™ PRO 9500
|Tungsten (W) Polishing||IKONIC™ 4250H, 4121H, 4141H
|STI Polishing/Ceria Polish Applications||IKONIC™ 4121H, 4140H, 4250H
VISIONPAD™ 5000, 6000
|Oxide Polishing||VISIONPAD™ 5000, 6000, 7480
|Buff Polishing||IKONIC™ 2010H, 2020H, 2040H, 2060H
OPTIVISION™ 4540, 4548
POLITEX™, POLITEX™ AT