Materials for Chemical Mechanical Planarization (CMP)

CMP Slurries

CMP Slurries

High-quality CMP slurries backed by the strength of DuPont

Since the earliest days of the chemical mechanical planarization (CMP) process, we’ve been providing CMP slurries to the semiconductor market. Today, the second largest volume supplier of CMP slurries in the world, and the largest provider of CMP consumables overall, DuPont is strategically positioned to provide solutions for increasingly complex CMP process requirements.

DuPont’s slurry offerings include a broad range of dielectric and metal polishing solutions.  Our ongoing investment in slurry technology includes a well-funded research and development program, an established and growing product portfolio, and a global footprint of application centers to engage directly to meet customers’ needs.

DuPont CMP Slurry Product Families

Optiplane™ Slurries

The Optiplane™ slurry platform is a family of advanced dielectric, nitride and polysilicon slurries with tunable removal rates and selectivities that can meet defect reduction requirements and tighter specifications at a competitive cost for manufacturing the next generation of advanced semiconductor devices.

Acuplane™ Advanced Barrier and TSV Slurries

The Acuplane™ slurry platform includes copper barrier and through silicon via (TSV) slurries with a tunable range of film selectivity. Acuplane ™ demonstrates predictable performance in logic and memory integration schemes and is available in production volumes for both mature and advanced device nodes.

Klebosol® Slurries

DuPont is the exclusive provider of Klebosol® slurries. Klebosol® slurries are the most widely used water-glass colloidal silica products for CMP of semiconductor devices, interlayer dielectrics, shallow trench isolation, polysilicon, and post-metal buff. The silica particles are grown in a liquid medium and maintain excellent stability.

DuPont CMP Slurry Applications

  • Front-end-of-line (FEOL) – Optiplane™ slurries are designed to help customers achieve complex FinFET and advanced front-end memory device integrations. DuPont achieves this by delivering broad, independent control of removal rate for oxides, nitrides and polysilicon materials.
  • Interlayer dielectrics (ILD) – Optiplane™ and Klebosol® slurries are designed to prioritize rate and planarization while minimizing surface defect density and process cost. DuPont’s portfolio includes long-established mature node products using Klebosol® abrasives as well as ultra-high purity abrasives for advanced node ILD needs.
  • Barrier metals – Acuplane™ slurries are designed to precisely remove barrier metals used on copper and cobalt metallization schemes. DuPont slurries are designed as platforms on which customers can request a range of selectivity options. These options enable customers to control final metal interconnect/line thickness, correct topography and control metal and dielectric surface quality.
  • Through silicon via (TSV) – DuPont has an industry-leading portfolio of Acuplane™ TSV slurry solutions for both front and backside polishing. These slurries accommodate silicon, oxide and metal removal needs as defined by customers’ specific device integration needs.
  • Advanced packaging materials – Building on DuPont’s TSV, silicon and polymer polishing expertise, our advanced packaging slurry portfolio extends to enable chip-on-wafer-on-substrate (CoWoS) and silicon interposer integration schemes, as well as polymer polishing capability.

® Klebosol is a registered trademark of Merck KGaA, Darmstadt, Germany or its affiliates.

  • The chemical mechanical planarization (CMP) process is used to planarize both die level and wafer level topography and also to remove overfill metal and metalloid materials that serve as interconnects in an integrated circuit. CMP pads and slurries are used together in combination on a polishing tool multiple times throughout the semiconductor fabrication process.

    Slurries are made up of a combination of key additives which enable precise polishing of the wafer surface. Slurries are designed to enable the planarization and material removal such that surface quality and material property integrity is maintained or improved. State-of-the-art polishing slurries enable topography or flatness to be maintained at or less than 300 angstroms across a 300mm wafer. Surface finish of materials, including corrosion sensitive metals, is maintained at the single-digit angstrom level.

  • DuPont also offers Nanopure™ slurries for silicon wafer polishing and the ILD™ 3000 -5000 series for interlayer dielectrics.

Materials for CMP

  • CMP Slurries
  • CMP Pads

CMP Slurries

A range of offerings for chemical mechanical planarization (CMP) including Optiplane™, Acuplane™ and Klebosol® slurries.

CMP Pads

Broad portfolio of CMP pads to meet the needs of any application.

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IC1000™ CMP Polishing Pads

Setting the standard for performance in chemical mechanical planarization


Ikonic™ Polishing Pads

A breakthrough pad platform designed for advanced nodes


Optivision™ CMP Polishing Pads

Second-generation soft CMP pads designed for improvements in cost of ownership

Optivision™ PRO CMP Polishing Pads

Our newest soft CMP pad designed to facilitate advanced polishing


Politex™ CMP Polishing Pads

The industry standard soft pad for multiple CMP applications


Suba™ Polishing Pads

The industry standard CMP pad for silicon stock removal polishing


Visionpad™ Polishing Pads

Advanced CMP technology that suits multiple polishing applications