Damascene Copper

NANOPLATE™ and ULTRAFILL™ Series Electroplating Copper chemistries are production-proven in semiconductor manufacturing for memory and logic applications at 32 nm and below. With a three-component additive chemistry, Dow Electronic Materials’ electroplating copper is capable of robust gap filling of aggressive features while meeting electro-migration and via stress migration in fab qualifications. Through controlled purity of copper deposits and its exceptional leveling capabilities, Dow Electronic Materials’ electroplating copper delivers lower defectivity which translates into higher yields.