DuPont is a leading manufacturer of specialty chemicals used in the removal of photoresist post-dry etch process residue and chemical mechanical polishing (CMP) defectivity.
Our EKC Technology products provide best-in-class process solutions for wafer cleaning, surface preparations, liquid and dry film resist removal, post CMP cleaning, selective etching and post-etch residue removal. DuPont's specialized formulations allow you to achieve higher productivity and improved yields on designs with finer line width and spacing.
Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.View Details
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.View Details
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.View Details
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contactsView Details
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printingView Details
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfacesView Details