Electrolytic Wafer Plating Processes

To fill a variety of other metallization needs in advanced packaging, Dow Electronic materials offers both gold and nickel electroplating solutions. The electrolytic plating materials are provided in ready to use formulations that are suitable for semiconductor applications. The materials deliver a variety of plating characteristics, including uniform deposits, excellent solderability, high cathode efficiency, low-porosity, high ductility and excellent performance as copper diffusion barrier.