Lithography Materials and Services

Electronic Grade Polymers

Electronic Grade Polymers Ideal for Today’s Challenging Lithographic Applications

DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.

Our synthetic and isolation expertise enables Electronic Polymers to create a wide range of polymers that are ideal for today’s challenging lithographic applications, from Acetoxystyrene Monomer (ASM) to High Compositional Uniformity (HCU) polymers.

ASM

Acetoxystyrene monomer (ASM) is the basic monomer for generation of DuPont electronic grade polymers. Used either in combination with other reactive monomers or used as the sole component for homopolymer generation, ASM is a high purity reactive monomer which readily undergoes free radical polymerization and enables the production of poly(p-acetoxy)styrene (PAS) polymers in a wide range of molecular weights. We exercise great care and effort to maintain the highest possible quality of this key material.

Co- and Ter-Polymers via Custom Manufacture

DuPont has developed a deep expertise in free radical polymerization chemistry. Custom produced resins made from a wide variety of monomers, in combination with ASM, address the growing needs for transparency, polydispersity, acid diffusion characteristics, dissolution rate, Tg, and other factors essential to the performance of photoresists used in critical layers of semiconductor device manufacture.

Lithography Materials and Services

  • Electronic Grade Polymers
  • Advanced Overcoats
  • Anti-Reflectants & Functional Sublayers
  • Ancillary Lithography Materials
  • Photoresists
  • Metrology & Imaging Services

Electronic Grade Polymers

DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.

Advanced Overcoats

Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.

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Anti-Reflectants & Functional Sublayers

Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.

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AR™ 10L Bottom Anti-Reflectant Coating

An organic, thermally cross-linking BARC for 248 nm photoresists

AR™ 137 Organic Bottom Anti-Reflectant Coating

An organic bottom anti-reflectant coating (oBARC) for immersion lithography

AR™ 201 Organic Gap Filling Anti-Reflectant Coating

An organic gap filling material for extremely narrow trenches

AR™ 254 Thermally Cross Linking Bottom Anti-Reflectant Coating

An organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist

AR™ Fast Etch Organic Bottom Anti-Reflectant Coatings

A family of cross-linkable BARCs that can etch 30% faster than photoresists


Ancillary Lithography Materials

DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.

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Photoresists

DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.

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ArF Dry Resist

Positive tone ArF (193 nm) dry photoresists optimized for trench and line/space applications

ArF Immersion Contact Hole

Positive tone 193 nm immersion resists with an excellent process window, CD uniformity and low defectivity

ArF Implant Resist

Positive tone 193 nm implant resists with good profile through pitch and excellent substrate compatibility


Metrology & Imaging Services

We offer services such as defect testing or patterning wafers

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