HKPCA & IPC Show

6 – 8 Dec, 2017

Shenzhen, China

2017 International Printed Circuit & APEX South China Fair

Shenzhen Convention and Exhibition Center, China (Hall 2, Booth 2H11)

We’re looking forward to the HKPCA & IPC Show 2017 where this year we’re all about big solutions for advances in tomorrow’s electronics!

在今年的HKPCA & IPC展会,期待与您分享,我们为电子产业进步而研发的解决方案

International Technical Conference 国际技术会议

  • Date 日期: Thursday, Dec 07
  • Time 时间: 13:30 – 14:15
  • Location 地点: Hall 4
  • Lead Author 演讲人: Mr. Robert Pan (C&IT marketing announcement, BD Leader- PCB Metallization, EP)/ Dr. Mark Lin (林賢勳 博士), Riston® R&D Manager
  • Topic 主题:
    • SFP for IC PKG and Potential for Smartphone Advanced Pattern Plating (新世代均匀性改善及镀薄铜填孔电镀铜技术)
    • Novel Fine-line Riston® LDI Photo-resist for Advanced MSAP Application (新世代雷射曝光專用光阻於細線路類載板先進製程之應用)
  • Read Connectivity Blog 閱讀Connectivity博客 

Posters 海报

View the posters Dow Electronic Materials is showcasing at the HKPCA & IPC Show, Dec 6-8, 2017. All posters are provided as Adobe Acrobat PDF files.

Cost Effective Viafill Electroplating on HDI Application 
应用在HDI具成本效率之填盲孔电镀铜技术

Excellent Uniformity Viafill Electroplating Technology on IC Substrate 
应用于IC载板上高均匀性的盲孔填孔解决方案

Next Generation Vertical Electroless Copper Process with Ionic Pd Catalyst System for High-end products
应用于高端线路板之下一世代垂直化铜工艺(离子钯系统)

High Performance PPR Copper Plating for HAR Boards
应用于高纵横比线路板 上之高性能脉冲电镀铜

Final Finishing – High Performance Selective ENIG Technology 
表面处理–高性能选择性化学镍金技术

New Generation Via Filling Acid Copper Plating Technics for Improving Distribution Uniformity and Thinner Copper 
新世代均匀性改善及 镀薄铜填孔电镀铜技术

New Tin Plating Technology for VCP Application 
新一代应用于VCP的电镀锡技术

High Speed Direct Current Copper Electroplating Technology of High Throwing Power Solution 
具有高深镀能力的高速直流电镀铜制程

 

Horizontal Desmear/PTH 
水平除胶渣/化学沉铜 
Universal Electroless Copper
泛用型化学沉铜