Semiconductor Packaging Silicones

The semiconductor back-end faces constant and emerging challenges including novel manufacturing technologies, the continued reduction in bond pad pitch, the emergence of multichip packages and package-on-package assemblies, and perpetual demand for more I/Os.

These trends are fueling more technologically sophisticated and environmentally friendly manufacturing processes, as well as new device architectures that deliver increased performance and uncompromising reliability. Our broad portfolio of proven silicon-based thermal interface materials, die attach adhesives, lid seal adhesives, die encapsulants and conformal coatings are designed to help you meet these evolving industry demands. Delivering consistent performance in the most extreme chip-manufacturing environments, they offer numerous benefits, including:

  • High purity
  • Improved stress relief
  • High thermal stability
  • Excellent chemical resistance
  • Low moisture absorption
  • Strong environmental protection
  • Faster, simpler processing
  • Improved cost of ownership
  • Compliance with environmental regulations