The CB Series of screen printed ink materials are used for additive, low temperature processing on both rigid and flexible printed circuit boards (PCBs). These products provide increased yields and reduce processing steps.
CB100 - Conductive Via Fill
This high performance viaplug product line was developed to planarize high density PCBs, enhancing both thermal and electrical conductivity for applications ranging from ball grid arrays, buried vias or PCBs with microvia layers.
CB102 - Next Generation Conductive Via Fill
All of the benefits of our conductive via fill with improved process capabilities for smaller diameter vias.
CB200 - Rigid Copper Shielding & Circuit Formations
With excellent printing properties, silver-like conductivity, and strong adhesion to a wide variety of substrates, DuPont CB200 copper conductors provide an excellent value for on-board electromagnetic interference / radio frequency interference (EMI/RFI) shielding on rigid circuits. They can also be used to fabricate low-voltage circuitry or jumpers in certain applications.
CB028 - Flexible Silver Shielding
Used to provide electromagnetic interference / radio frequency interference (EMI / RFI) shielding on rigid or flexible printed circuit board (PCB) substrates.
CB230 - Print Additive Circuits
DuPont CB230 silver-coated copper conductors are specifically formulated to offer excellent solderability and leach resistance, helping create additive circuitry, electrodes, and termination sites across a wide variety of substrates. Its strong adhesion to a wide variety of substrates makes it an excellent choice for substrates as diverse as aluminum, rigid and flexible polymer laminates, glass, and ceramic.
CB459 - Thin, High Adhesion Platable Seed Layer
CB459 is an additive that can be used as an overprint for via fills in rigid and flexible laminates. It offers good platability and increased bond strength on epoxy-based, non-conductive via fill materials. This versatile material can be used on a variety of printed circuit board resin systems.
CB500 - Temporary Conductor for Electroplating (Bus Bar)
CB500 is a printed silver conductor ink designed to simplify selective electroplating applications in the manufacturing of PCBs. It eliminates the need for bus bars or other copper plating connections, reduces the chance of forming unintended copper antennae, and removes the need for “after-plating”, ultimately reducing total processing costs.
The CB Series of screen printed ink materials are used for additive, low temperature processing on both rigid and flexible printed circuit boards (PCBs).
Used in tenting, plating, akaline etching or innerlayer applications.View Details
Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation using dry lamination and possess wide exposure, developing and stripping latitude.
DuPont has developed the Riston® FX Series of photoresists to help fabricators address challenges of producing fine lines at high yields.
Riston® GoldMaster is a fully aqueous resist that simplifies circuit board fabrication with special gold plating or nickel plating finishes
Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.
DuPont™ Riston® MultiMaster Series simplifies the manufacturing operation by eliminating the need for different films in your production line.
Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate.
DuPont™ Riston® TentMaster provides excellent tenting capability, outstanding conformation, excellent resolution and remarkable tolerance to off-contact exposure.
For use in exposing liquid and dry film photoresists (including solder masks) employed in the manufacture of PWBs.View Details