With more than 50 years invested in technology development, DuPont Electronics & Imaging understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.
We draw from other areas of the company to leverage expertise across the entire electronics manufacturing supply chain.
Through close relationships with leading-edge manufacturers, we develop new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out wafer level packaging and through silicon vias (TSVs). We are technology leaders in electroplating materials used for underbump metallization (UBM), copper redistribution layer (RDL), Cu pillars, and solder bumps, along with polymers and dielectrics for RDL. Other advanced materials include photoresists and TSV fill.
Choose DuPont as your materials solutions partner to:
Semiconductor packaging materials are a class of electronic solutions used to form the connection of the Semiconductor packaging materials are a class of electronic solutions used to form the connection of the IC chip to the package substrate, another package or directly to the printed circuit board. These materials are critical to semiconductor wafer-level packaging processes, heterogeneous integration, and 3D integration technologies.
Today's leading-edge electronics are expected to have more functionality packed in a smaller form factor, using less power, while improving performance and reliability. These devices power mobile devices, high performance computers, the IoT, memory, automotive electronics, the 5G networks of the future and more. They rely on semiconductor packaging materials that follow the Heterogeneous Integration Roadmap (HIR) and are designed to meet these stringent requirements.
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.View Details
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.View Details
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.View Details
Indium plating chemistry designed for low-temperature solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature.
HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility.
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needsView Details
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.View Details
Wafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.
DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.View Details
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.View Details