Thermal Management Materials

We’ve Put Thermal Resistance in Its Place

Effective heat management is key to optimum performance in electronic applications ranging from semiconductors to LED lighting. DuPont thermal management materials provide a high-quality, reliable choice for managing heat and reducing thermal resistance in a wide variety of electronic assemblies to enhance performance and extend product lifetime for a variety of applications.  

Available in a variety of formats—from films and adhesive thermal tapes to non-silicone greases and dispensable gap fillers—DuPont products are differentiated from the competition with either higher thermal conductivity, lower thermal resistance, improved handleability or improved thermal stability during continuous operation. 

All DuPont thermal management materials are designed to withstand the harsh conditions in today’s technologically advanced electronic devices and products while providing an excellent balance of electrical, thermal, mechanical, physical and chemical properties. 

Thermal Management Materials

  • Temprion™ Thermal Management Materials

Temprion™ Thermal Management Materials

Thermal management materials in the DuPont™ Temprion™ family include films and adhesive thermal tapes.

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Temprion™ AT Adhesive Thermal Tape

Temprion™ AT thermal adhesive tape is pressure sensitive, highly conformable and features best in class thermal conductivity.

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Temprion™ EIF – Electrically Insulating Film

Featuring unrivaled thermal impedance (0.24 K·in2/W @ 30 psi) and best-in-class heat transfer, choose DuPont™ Temprion™ electrical insulation film.

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Temprion™ OHS - Organic Heat Spreader

Temprion™ OHS organic heat spreader imbues a remarkably high thermal conductivity within the plane of the film, with no effect on thermal transfer through the film.

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