DuPont began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films.
Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.
Riston® Laser Series Dry Film Photoresists Include:
Riston® LDI 8000
DuPont offers a complete set of conductors covering a broad application spectrum.
Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.
The conductors allow several different interconnect strategies, ranging from 25-micron gold wirebond to heavy gauge aluminum wirebond, wedge bond, ribbon bond, ball grid array (BGA), flip chips, and more.
Conductors for alumina substrates from DuPont include:
These conductors are co-fireable or sequentially fireable.
In addition, DuPont conductors for glass substrates offer these benefits: