DuPont Electronic Technologies Showcases Embedded Passives Technology at IPC Printed Circuits Expo

RESEARCH TRIANGLE PARK, NC, March 26, 2002 - DuPont Electronic Technologies, a leading global supplier of organic, flexible and ceramic circuit materials to the electronics industry, will showcase its latest developments in embedded passive materials and the development of standards in this technology-intensive field, at the IPC Printed Circuits Expo. The Expo will be at the Long Beach Convention Center in Long Beach, Calif., from March 26 - 28, 2002, in Booth 2050. Embedded passive technologies enable circuit board fabricators to bury passive components such as resistors and capacitors within the layers of printed circuit boards, bringing about reduced impedance between active components and size reduction in space-critical applications.

"We're very enthusiastic about embedded passive technology and the potential it has for helping fabricators meet increasing OEM demands for miniaturization and high speed performance," states David B. Miller, Vice President and General Manager, DuPont Electronic Technologies. "We have a broad variety of embedded passive technologies in development, and a deep understanding of the material science behind them. With these, we're finding ways of making the promise of embedded passives a practical reality for our customers in the very near future." DuPont Electronic Technologies is developing both advanced laminate and screen-printed embedded passive materials and processes.

DuPont introduces the first element of the embedded passives line with DuPont™ Interraä HK4, a planar embedded capacitor laminate for use as low inductance, low EMI power and ground planes for high frequency applications. There are also extensions of this offering, such as polyimide screen printable resistors and capacitors, under development. David McGregor, DuPont Senior Development Associate, will present a paper outlining design considerations that affect the performance of embedded capacitor materials in the IPC technical conference session S09, entitled "Embedded Passives I: A Very Active Topic" on Wednesday, March 27, at 10:00 a.m. Also an IPC subcommittee chairperson, McGregor is leading the industry to develop standards for materials, board performance, design and test methods dealing with embedded passive materials for capacitors, resistors, and inductors.

Dr. John Felten, DuPont Research Fellow, will present a paper in the same session on Wednesday describing the latest advances in the ceramic embedded passives technology development program. Ceramic embedded passives technology offers the potential for achieving the performance of surface mounted passive circuit components within the innerlayers of printed circuit boards in a simple and highly reliable process. DuPont ceramic embedded passives technology draws on decades of experience as a premier supplier of thick-film pastes to the resistive components and multi-layer capacitor industries.

"We're very proud of the progress we've made in advancing embedded passives," Miller concludes, "and we look forward to watching our customers succeed with this vital new technology."

For further information on DuPont Electronic Technologies, or products to be featured at the show, please visit our Web site at www.dupont.com/et.

DuPont Electronic Technologies is a $1 billion business unit that consists of six businesses dedicated to the electronics industry, including printed circuit materials, high-performance and micro-circuit materials, semiconductor fabrication materials and IC packaging and interconnects.

During 2002, DuPont is celebrating its 200th year of scientific achievement and innovation - providing products and services that improve the lives of people everywhere. Based in Wilmington, Del., DuPont delivers science-based solutions for markets that make a difference in people's lives in food and nutrition; health care; apparel; home and construction; electronics; and transportation.

3/26/02

DuPont™ and Interra™ are trademarks of E.I. du Pont de Nemours and Company.