DuPont Electronic Technologies to Present Abbreviated Course on Embedded Passives Design at PCB Design Conference West

RESEARCH TRIANGLE PARK, N.C., Feb. 7, 2003 -- DuPont Electronic Technologies, a leading global supplier of organic, flexible and ceramic circuit materials to the electronics industry, and Coretec Inc., a leader in time-sensitive advanced printed circuit board manufacturing, will jointly present the abbreviated course "Embedded Passives: Materials, Design and Implementation" on Thursday, March 13 at the upcoming PCB Design Conference West at the San Jose Convention Center in San Jose, Calif. The course will educate engineers and designers on the current state-of- the-art in the field of embedded passives and provide training on how to implement the technology in new printed circuit board applications.

Embedded passives enable circuit board fabricators to bury passive components such as resistors and capacitors within the layers of printed circuit boards, bringing about reduced impedance between semiconductor chips and size reduction in space-critical applications. New materials and processes for embedding passives from DuPont enable designers to bury critical functions such as terminating resistors and decoupling capacitors in proven processes in use at leading fabricators around the world. The technology is particularly suited to applications with a high component density in markets such as high-performance computing, automotive, telecommunications, and consumer electronics.

The course will be presented by William Borland, research fellow of DuPont Electronic Technologies, and Richard Snogren, director of U.S. Field Applications Engineering for Coretec Inc.

"DuPont is excited about the embedded passives market opportunity and our products are well-suited to meet customer needs," said DuPont Microcircuit Materials business leader Harold L. Snyder, president. "Coretec's design capabilities and expertise in the fabrication of embedded passives boards as well as the experience generated by both companies can help guide the way for designers to take advantage of this essential new technology for meeting next generation packaging requirements."

According to Paul Langston, CEO of Coretec Inc., "Embedded passives represent a key research and development initiative for Coretec and offer an outstanding opportunity to demonstrate our advanced interconnect capabilities to a marketplace yearning for performance and functionality enhancements."

For information on registering for the embedded passives - course at the PCB Design Conference West, see the website at www.pcbwest.com.

DuPont and Coretec are both members of the NIST Advanced Embedded Passives Technology consortium, working together to develop the capability to design and build printed circuit boards containing ceramic embedded passives technology.

DuPont Electronic Technologies is developing both advanced laminate and screen-printed embedded passive materials and processes under the brand name DuPont™ Interra™ embedded passives. The first element of the embedded passives product line, Interra HK4, a planar embedded capacitor laminate for use as low inductance, low EMI power and ground planes for high frequency applications, was introduced at the IPC Printed Circuit Expo in the spring of 2002.

DuPont Electronic Technologies is a $1 billion business unit that consists of eight businesses dedicated to the electronics industry, including printed circuit materials, high-performance and micro-circuit materials, semiconductor fabrication materials and IC packaging and interconnects. For further information on DuPont Electronic Technologies, visit the websitee at www.dupont.com/et.

DuPont is a science company. Founded in 1802, DuPont puts science to work by solving problems and creating solutions that make people's lives better, safer and easier. Operating in more than 70 countries, the company offers a wide range of products and services to markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.

2/10/03

DuPont™ and Interra™ are trademarks of E.I. du Pont de Nemours and Company.