Thermal Management a Critical Factor in LED Lighting Devices
DuPont offers packaging and thermal substrate technologies that deliver better thermal management, are more reliable, and are cost-efficient.
Approximately 30 percent of the energy passing through a Light Emitting Diode (LED) chip is converted to light, while 70 percent is converted to heat, making thermal management a critical factor in today’s increasingly popular LED lighting devices.
The lighting industry continues to develop LEDs with higher lumens per watt. These advancements drive the need for packaging and thermal substrate technologies that deliver better thermal management, are more reliable, and are cost-efficient.
Despite the lighting industry’s ability to provide more lumens per watt than ever before, an LED’s reliability and performance depend greatly on how it is packaged and mounted. The main drivers of technology development in this area are directly related to increasing lumens per watt while decreasing overall costs.
LED lighting manufacturers, in order to deliver on the value proposition of a long lifetime, have to be able to dissipate heat efficiently.
INFORMATION & IDEAS
This article, featuring DuPont™ CooLam® thermal substrates, focuses on the role of thermal substrates such as Metal Core Printed Circuit Boards (MCPCBs) to optimize LED performance.