Through integration efforts by DuPont, and five industry pioneers will jointly exhibit various advanced wearables applications that use DuPont stretchable electronics inks in garments, insoles and other novel applications.
The portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes.
Latest white paper to help engineers and specifiers select polymers that comply with regulatory, environmental, safety and performance requirements
The technology will enable digital printing for electronic components and circuits in applications where extremely fine lines are required, such as OLED panels, solar cells, printed antennae and touch panels.
New materials include conductive inks for wearable and in-mold electronics, and materials that can be processed at very high or low temperatures, expanding the range of applications in the growing printed electronics field.
DuPont Microcircuit Materials is introducing a suite of in-mold electronic inks designed to help streamline electronic devices by reducing the need for rigid circuit boards. The inks offer important design, manufacturing, weight and cost advantages.
The new DuPont™ PE827 and PE828 low-temperature inks cure at as low as 60°C, opening up the possibility for printed electronics designers to use less expensive plastic films.
The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.
The Pyralux® HT 225ºC service temperature enables designers to use flexible circuits for the first time in high-temperature environments such as aerospace and automotive engines, brakes and transmissions, and downhole pumps for oil and gas drilling.
DuPont Microcircuit Materials has introduced a suite of stretchable electronic ink materials for use in smart clothing applications and other wearable electronics.
DuPont is expanding its suite of low silver, conductive ink materials specifically tailored for membrane touch switch (MTS), radio-frequency identification (RFID), and wearable electronic applications.
DuPont anticipates that new nano-silver conductor ink materials, will be commercially available next year and that these materials will be able to provide a combination of extremely high conductivity and excellent adhesion even after substrate cleaning steps.
DuPont and Holst Centre have extended their collaboration focused on advanced materials for the printed electronics industry.
DuPont Microcircuit Materials is introducing its first pure copper conductive ink for photonic curing, DuPont™ PE510 copper conductor. DuPont™ PE510 is a cost-effective alternative to silver conductor inks for a variety of applications.