DuPont™ Interra™ thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric specifically designed for use in multilayer rigid printed circuit boards.
Kalrez® perfluoroelastomer parts (FFKM) resist over 1,800 different chemicals and withstand temperatures up to 327ºC. This elastomer is widely used in demanding chemical processing and semiconductor manufacturing, as well as pharmaceutical, aerospace and oil & gas applications.
From the circuits in the cameras on space missions to the next generation of photovoltaic cells, DuPont™ Kapton® polyimide films are helping make extraordinary new design possibilities actually happen.
Nomex® paper and pressboard have earned a reputation for delivering superior quality and proven reliability for a wide range of electrical insulation applications, meeting the ever-increasing demands of a changing world.
DuPont™ Oasis® composite film is a family of heat sealable fluoropolymer-coated polyimide materials that are designed specifically to meet the demands of the aerospace and cable industry.
DuPont™ Pyralux® flexible circuit materials have long been essential to the flex circuit industry. Pyralux® enables the fabrication of thin, solderable, high-density electrical interconnects for single- and double-sided, multilayer flex and rigid flex circuitry applications.
The very first dry film photopolymer photoresist, DuPont™ Riston® dry film revolutionized printed circuit board fabrication methods. Today, Riston® is just as critical as ever to printed wiring and circuit-board production. Fabricators choose DuPont for improved product and process solutions that keep them both competitive and profitable.
Vespel® parts and shapes are custom-made based on application need - offering sealing capabilities as well as protection against wear, friction and high temperatures.