DESIGN TIP: Need for Anchoring Spurs and Pad Fillets
The examples show a covercoated pad area in a Type 1 (single-sided) or Type 2 (double-sided) application.
The “poor design” has two major potential flaws:
1. The pad is subject to lifting during soldering or assembly operations.
2. There is a weak point at the conductor/pad interface. Any stress to this area can cause a fracture of the conductor at this point.
The “robust design” has the following advantages:
1. With the addition of the anchoring spur and pad fillet, the amount of “hold down” has been dramatically increased.
2. The fillet increases the copper surface area greatly increasing its strength, virtually eliminating any risk of conductor fracture at the pad/conductor interface.
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