Pyralux® LF-B provides a uniform, aesthetically pleasing appearance to flexible printed circuit materials
DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products here uniform matte black appearance is desired.
The coverlay is made with the leading DuPont™ Kapton® brand black polyimide film for high performance applications where matte-black material enhances design aesthetics. It is coated on one side with a proprietary B-staged modified acrylic adhesive. It is used in mobile devices, computers, military electronics, and 3-D lighting systems for automotive applications including daytime running lights (DRL), turn lights, high/low beam and rear lights, where aesthetically pleasing design and reliable high performance are imperative.
• Color stable matte black surface
• Crease and scratch resistance
• Flexible to enable 3D LEDs for curved light designs
• Proven reliability adhesive system
• Maintains appearance through high temperature cycles
• Available in DuPont™ Kapton® B thicknesses of 0.5, 1.0, 2.0 mils; 3.0 and 5.0 are available upon special request
• Available in coated adhesive thicknesses of 0.5, 1.0, 2.0 mils
Pyralux® LF-B is used in conjunction with Pyralux® LF copper-clad laminate for automotive applications.
Product Data Sheets (1)
Additional Information (1)
RELATED DUPONT PRODUCTS & SERVICES
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® JT Coverfilm and Bonding Material is a polyamideimide-based technology for use in rigid-flex applications or higher temperature flex applications.
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.
INFORMATION & IDEAS
DESIGN TIP: Pad Only Plating
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.
DESIGN TIP: Epoxy Resin Fillets
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
DESIGN TIP: Minimum Bend Radius for Flex Circuits
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
DESIGN TIP: Need for Anchoring Spurs and Pad Fillets
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
DESIGN TIP: Balanced Circuit Pattern Reduces Premature Failure
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
DESIGN TIP: Pad Hold Down Options
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications