Pyralux® LF

Pyralux® LF Copper Clad Laminate, Coverlay, Bondply & Sheet Adhesive

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

Features

• High bond strength
• High thermal resistance
• Halogen-free
• Low outgassing, NASA data available
• No refrigeration required for storage
• Two-year product performance warranty
• Able to withstand multiple lamination cycles without degradation
• Wide processing latitude


Pyralux® LF Copper-Clad Laminate

Pyralux® LF acrylic based laminates are made with DuPont™ Kapton® polyimide film and are available in sheet form as single or double sided clads in a wide variety of thicknesses. Pyralux® laminated composites are typically used to produce high reliability, high density circuitry of flexible, rigid-flex, and all-flexible multilayer constructions.

Features:

• Certified to IPC 4204A/1
• Available in DuPont™ Kapton® thicknesses of 0.5, 1.0, 2.0, 3.0, and 5.0 mils
• Available in copper thicknesses of 0.5, 1.0, and 2.0 microns
• Available in copper types RA, DT (RA), ED
• Custom sizing available up to 50 inches in length
• Custom constructions available including unbalanced
 

Pyralux® LF Coverlay

DuPont™ Pyralux® LF coverlay composites are constructed of DuPont™ Kapton® polyimide film, coated on one side with a proprietary B-staged modified acrylic adhesive. Coverlay is used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation.

Pyralux® LF Bondply

DuPont™ Pyralux® bondply composites are constructed of DuPont™ Kapton® polyimide film coated on both sides with a proprietary B-staged modified acrylic adhesive. Bondply is used to encapsulate two etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton® and a layer of adhesive in low count multilayer constructions.

Coverlay and Bondply Features:

• No tack for ease of registration
• Excellent encapsulation ability
• Available in DuPont™ Kapton® thicknesses of 0.5, 1.0, 2.0, 3.0, and 5.0 mils
• Available in coated adhesive thicknesses of 0.5, 1.0, 2.0, and 3.0 mils
• Custom constructions available
• Certified to IPC 4203A/1
 

Pyralux® LF Sheet Adhesive

DuPont™ Pyralux® LF sheet adhesive is a proprietary B-staged modified acrylic adhesive coated on release paper. Sheet adhesive is used primarily to bond flexible innerlayers or rigid cap layers in multilayer lamination. It is also widely used to bond flexible circuits to rigid boards during the fabrication of rigid-flex circuits, as well as to bond stiffeners and heat sinks.

Sheet Adhesive Features

• Excellent bond strength for stiffener attachment
• No tack for ease of registration
• Excellent encapsulation ability
• Available in adhesive thicknesses of 0.5, 1.0, 2.0, 3.0, and 4.0 mils
• Low outgassing, NASA data available
• Certified to IPC 4203A/18

 

RELATED DUPONT PRODUCTS & SERVICES

  • Pyralux® TK

    DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.

  • Pyralux® AP

    DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

  • Pyralux® LF-B

    DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products here uniform matte black appearance is desired.

  • Pyralux® HXC

    DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.

  • Pyralux® FR

    DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

  • Pyralux® AC

    DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

INFORMATION & IDEAS