Pyralux® LG Glass Reinforced Bonding Film
DuPont™ Pyralux® LG is an acrylic impregnated glass fabric composite heat sink bonding and stiffener applications.
Pyralux® LG impregnated glass fabric composites combine the features of a proprietary B-staged modified acrylic adhesive with the stability and mechanical toughness of woven glass fabric.
• High bond strength
• High thermal resistance
• Low outgassing, NASA data available
• No refrigeration required for storage
• Two-year product performance warranty
• Able to withstand multiple lamination cycles without degradation
• Wide processing latitude
• Impregnated glass fabric composites
• Certified to IPC 4203A/17
Additional Information (1)
RELATED DUPONT PRODUCTS & SERVICES
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® JT Coverfilm and Bonding Material is a polyamideimide-based technology for use in rigid-flex applications or higher temperature flex applications.
DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products here uniform matte black appearance is desired.
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.
INFORMATION & IDEAS
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications