Pyralux® LG Glass Reinforced Bonding Film
DuPont™ Pyralux® LG is an acrylic impregnated glass fabric composite heat sink bonding and stiffener applications.
Pyralux® LG impregnated glass fabric composites combine the features of a proprietary B-staged modified acrylic adhesive with the stability and mechanical toughness of woven glass fabric.
• High bond strength
• High thermal resistance
• Low outgassing, NASA data available
• No refrigeration required for storage
• Two-year product performance warranty
• Able to withstand multiple lamination cycles without degradation
• Wide processing latitude
• Impregnated glass fabric composites
• Certified to IPC 4203A/17
Product Data Sheets (1)
Additional Information (1)
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DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.
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INFORMATION & IDEAS
DESIGN TIP: Need for Anchoring Spurs and Pad Fillets
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
DESIGN TIP: Pad Hold Down Options
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications
DESIGN TIP: Epoxy Resin Fillets
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
DESIGN TIP: Balanced Circuit Pattern Reduces Premature Failure
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
DESIGN TIP: Minimum Bend Radius for Flex Circuits
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
DESIGN TIP: Pad Only Plating
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.