Pyralux® PC Photoimageable Coverlay
DuPont™ Pyralux® PC 1000 is a modified acrylic flexible photoimagable dry film coverlay used for single and double sided applications that require fine line resolution along with bend and crease flexibility.
This flexibility is maintained throughout typical assembly processes as well as after exposure to environmental extremes such as thermal shock and high temperature and humidity.
• Bend and crease performance
• Robust chemical resistance
• Excellent solder resistance
• High resolution
• Excellent encapsulation of thin copper circuitry
Product Data Sheets (1)
RELATED DUPONT PRODUCTS & SERVICES
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.
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DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.
INFORMATION & IDEAS
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications