Pyralux® PC

Pyralux® PC Photoimageable Coverlay

DuPont™ Pyralux® PC 1000 is a modified acrylic flexible photoimagable dry film coverlay used for single and double sided applications that require fine line resolution along with bend and crease flexibility.

This flexibility is maintained throughout typical assembly processes as well as after exposure to environmental extremes such as thermal shock and high temperature and humidity.


• Bend and crease performance
• Robust chemical resistance
• Excellent solder resistance
• High resolution
• Excellent encapsulation of thin copper circuitry


  • Pyralux® TK

    DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.

  • Pyralux® AP

    DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

  • Pyralux® LF

    DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

  • Pyralux® JT

    Pyralux® JT Coverfilm and Bonding Material is a polyamideimide-based technology for use in rigid-flex applications or higher temperature flex applications.

  • Pyralux® AC

    DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

  • Pyralux® HXC

    DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.