Pyralux® PC Photoimageable Coverlay
DuPont™ Pyralux® PC 1000 is a modified acrylic flexible photoimagable dry film coverlay used for single and double sided applications that require fine line resolution along with bend and crease flexibility.
This flexibility is maintained throughout typical assembly processes as well as after exposure to environmental extremes such as thermal shock and high temperature and humidity.
• Bend and crease performance
• Robust chemical resistance
• Excellent solder resistance
• High resolution
• Excellent encapsulation of thin copper circuitry
Product Data Sheets (1)
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INFORMATION & IDEAS
DESIGN TIP: Pad Only Plating
This process is used on double sided (Type 2) circuits where maximum flexibility is desired.
DESIGN TIP: Epoxy Resin Fillets
The purpose of the fillet is to prevent conductors from being cracked when the circuit is flexed during installation.
DESIGN TIP: Minimum Bend Radius for Flex Circuits
Even though flex circuits are very pliable and flexible, there are limits to their flexibility.
DESIGN TIP: Need for Anchoring Spurs and Pad Fillets
During soldering or assembly operations any stress to the conductor/pad interface can cause a fracture of the conductor.
DESIGN TIP: Balanced Circuit Pattern Reduces Premature Failure
Preventing isolated stress conditions critical to ensure no premature falilure will occur in flexibile circuit
DESIGN TIP: Pad Hold Down Options
Design options for covercoated pad hold down for single-sided and double-sided flex circuit applications