All Polyimide Solutions

Pyralux® adhesiveless copper clad flexible laminates

DuPont adhesiveless all polyimide copper clad flexible laminates (CCL), using high performance Kapton® composite dielectrics, are available in a wide variety of copper types, thicknesses and construction options.

These laminates provide lightweight, both thin and thick,  and highly reliable substrates featuring superior circuit trace adhesion strength, lower Dk and Df properties, extreme environmental stability,  and greater design latitude for high frequency and impedance controlled applications.

All Polyimide Solutions Include:

Pyralux® AP - DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® AC - DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® APR - DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

Pyralux® HT - DuPont™  Pyralux® HT is an all polyimide flexible laminate system with the highest service temperature available today, that includes a double-sided copper-clad laminate and a unique all polyimide coverfilm or bonding material. 

Pyralux® JT - DuPont™ Pyralux® JT is a coverfilm or bonding material that becomes a flexible thermoset after processing. It can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications.

 

Pyralux® AC

Pyralux® AC products are ideal for use in single-sided applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® AP

DuPont™ Pyralux® AP has excellent thermal, chemical, electrical, and mechanical properties that make it ideal for use in high reliability rigid flex and multilayer flex circuitry.

Pyralux® AP-PLUS 

Pyralux® AP-PLUS all-polyimide thick copper-clad laminate offers a new range of greater core thicknesses - from 7 to 12 mils and up – dramatically improving signal integrity and further boosting reliability.

Pyralux® APR

Pyralux® APR copper clad resistor laminate is ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing is required.

Pyralux® AC

Pyralux® AC products are ideal for use in single-sided applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® AP

DuPont™ Pyralux® AP has excellent thermal, chemical, electrical, and mechanical properties that make it ideal for use in high reliability rigid flex and multilayer flex circuitry.

Pyralux® AP-PLUS 

Pyralux® AP-PLUS all-polyimide thick copper-clad laminate offers a new range of greater core thicknesses - from 7 to 12 mils and up – dramatically improving signal integrity and further boosting reliability.

Pyralux® APR

Pyralux® APR copper clad resistor laminate is ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing is required.

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