Conductive Materials for Hybrid Circuits

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AS Series Paste System

AS Series Paste System

DuPont AS series screen printable pastes are designed for creating circuitry directly onto aluminum substrates and heat sinks. The AS series paste is suitable for all applications requiring optimum thermal management such as LED lighting and power circuits.

Dielectric & Encapsulant Materials

Dielectric & Encapsulant Materials

DuPont offers the widest variety of thick film dielectrics for cross-overs, co-fireable and sequentially fired multilayer applications, including encapsulants and UV-curable polymer thick film (PTF) compositions.

Fodel™ Photo Defined Thick Film Ceramic Compositions

Fodel™ Photo Defined Thick Film Ceramic Compositions

The innovative Fodel™ system from DuPont is a complete photo defined thick film ceramic system, featuring silver and gold conductors and multilayer dielectric materials.

Heatel™ Thick Film Pastes

Heatel™ Thick Film Pastes

Thick film on steel substrates bring with them the advantages of low thermal mass, meaning quicker-heat up rate, improved controllability and therefore economy to the customer.

Laser Structurable Pastes

Laser Structurable Pastes

DuPont LS series laser structurable metallization pastes provide enhanced fine line capabilities through laser ablation, offering superior resolution to screen printing with sub-100 micron pitch.

Thick Film Resistor Materials for Hybrid Applications

Thick Film Resistor Materials for Hybrid Applications

DuPont is a leading supplier of thick film resistor materials for use in hybrid applications including chip resistors and networks.

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