DuPont Circuit & Packaging Materials Introduces New Pyralux® High Temperature Flexible Circuit Material System

Targets New Aerospace and Automotive Applications

Research Triangle Park, N.C., Feb. 18, 2015 – DuPont Circuit & Packaging Materials (DuPont) today announced the launch of its DuPont™ Pyralux® high temperature (HT) flexible circuit material system.  Pyralux® HT has a service temperature of 225º Celsius, the highest of any flexible circuit material system available today. The Pyralux® HT service temperature enables designers to use flexible circuits for the first time in high-temperature environments such as aerospace and automotive engines, brakes and transmissions, and downhole pumps for oil and gas drilling. DuPont will feature Pyralux® HT, as well as the rest of its innovative portfolio of flexible circuit solutions, at the IPC APEX Conference & Exhibition in San Diego, Calif., from Feb. 24-26, 2015, booth #1932.  

“The Pyralux® HT system opens new doors for the use of flexible circuits,” said Mark T. Dirks, global segment leader, DuPont Circuit & Packaging Materials.  “Designers concerned about high temperatures in demanding environments now have an innovative new material that can withstand heat and has the reliability they know they can expect from DuPont materials.”

The all-polyimide Pyralux® HT flexible circuit material system has a service temperature of 225º Celsius (437º Fahrenheit), the highest of any flexible circuit material system.  The system includes a double-sided copper-clad laminate and a unique all-polyimide bonding film that becomes a flexible coverlay after processing.  Offered in a full range of dielectric thicknesses, the Pyralux® HT system provides designers, fabricators and assemblers a versatile option for a wide variety of flexible circuit constructions.

DuPont set the standard for flexible circuit materials more than 20 years ago with the introduction of the Pyralux® AP flexible circuit material system.  The Pyralux® portfolio enables the design of increasingly complex circuits with greater functional capacity, while providing the high reliability, excellent quality and consistency that the industry requires. 

DuPont Circuit & Packaging Materials offers a broad and growing portfolio of products including dry film photoresists and phototooling films for Printed Circuit Board (PCB) imaging, polyimide films, flexible circuit materials, embedded passive materials and thermal substrates for LED lighting.  For information on DuPont flexible circuit materials please visit pyralux.dupont.com.

DuPont (NYSE: DD) has been bringing world-class science and engineering to the global marketplace in the form of innovative products, materials, and services since 1802.  The company believes that by collaborating with customers, governments, NGOs, and thought leaders we can help find solutions to such global challenges as providing enough healthy food for people everywhere, decreasing dependence on fossil fuels, and protecting life and the environment.  For additional information about DuPont and its commitment to inclusive innovation, please visit http://www.dupont.com.

 

 

The Pyralux® HT bonding film is part of the HT flexible laminate system that has the highest service temperature of any flexible circuit material system available today.