Innovative Thin Copper Clad Laminates Push Electrical Boundaries
DuPont™ Interra™ thin copper clad laminates are specifically designed for use in multilayer rigid printed circuit boards.
All Interra™ thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric. This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards. The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance which are inherent benefits compared to traditional rigid circuit board materials.
DUPONT PRODUCTS & SERVICES
DuPont™ Interra™ FL thin copper clad laminate is a polyimide film laminated on both sides with low-profile electrodeposited (ED) copper for use in multilayer rigid circuits.
Interra® HK 04J
DuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.