Interra™ thin copper clad laminates

Innovative Thin Copper Clad Laminates Push Electrical Boundaries

DuPont™ Interra™ thin copper clad laminates are specifically designed for use in multilayer rigid printed circuit boards.

All Interra™ thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric.  This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards.  The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance which are inherent benefits compared to traditional rigid circuit board materials.

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