Innovative Thin Copper Clad Laminates Push Electrical Boundaries
DuPont™ Interra™ thin copper clad laminates are specifically designed for use in multilayer rigid printed circuit boards.
All Interra™ thin copper clad laminates utilize low-profile electrodeposited (ED) copper laminated to thin polyimide based dielectric. This dielectric is engineered to have superior adhesion to copper than traditional glass-reinforced materials utilized in rigid boards. The polyimide dielectric is based on DuPont™ Kapton® technology, but is specifically engineered to have low dielectric loss, high dielectric isolation and strength, and tight thickness tolerance which are inherent benefits compared to traditional rigid circuit board materials.
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DuPont™ Interra™ FL thin copper clad laminate is a polyimide film laminated on both sides with low-profile electrodeposited (ED) copper for use in multilayer rigid circuits.
Interra™ HK 04J
DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.