Fine Line Resolution on Panel Plate
The demands on printed circuit manufacturers are continually increasing as the market demands finer features.
DuPont™ Riston® PlateMaster was formulated to achieve consistently high yields by providing outstanding plated line uniformity, fine line resolution, and wide surface tolerance on direct metallization and panel plate. In addition to high yields, PlateMaster was designed to give the fabricator robust process latitude.
Riston® PlateMaster Series Includes:
Riston® PlateMaster PM300
Riston® PM300 is the next generation fine line copper/tin and copper/solder plating film. Excellent resolution and wide processing latitude give the pwb fabricator the ability to produce the ever more demanding plated feaures for the designs of today and tomorrow.
Riston® PM300 benefits:
- Fine line capability
- Excellent conformation
- Easy stripping
- No sludge formulation
Riston® PlateMaster PM200
Riston® PlateMaster PM200 is an industry proven film providing high yields and high productivity for plating of copper, tin and lead. Clean development and stripping on a wide variety of surfaces facilitates high yield.
Riston® PM200 is available worldwide in 40 micron, 50 micron, 75 micron thicknesses.
Product Data Sheets (4)
RELATED DUPONT PRODUCTS & SERVICES
DuPont has developed the Riston® FX Series of photoresists to help fabricators address challenges of producing fine lines at high yields.
Riston® EtchMaster dry film photoresist is specifically designed as an acid etching film that delivers high yields in fine line applications. These photoresists provide excellent conformation using dry lamination and possess wide exposure, developing and stripping latitude.
Riston® GoldMaster is a fully aqueous resist that simplifies circuit board fabrication with special gold plating or nickel plating finishes
DuPont™ Riston® MultiMaster Series simplifies the manufacturing operation by eliminating the need for different films in your production line.
DuPont™ Riston® TentMaster provides excellent tenting capability, outstanding conformation, excellent resolution and remarkable tolerance to off-contact exposure.
Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.