DuPont CB Series of screen printed ink materials
The CB Series of screen printed ink materials are used for additive, low temperature processing on both rigid and flexible printed circuit boards (PCBs). These products provide increased yields and reduce processing steps.
CB100 - Conductive Via Fill
This high performance viaplug product line was developed to planarize high density PCBs, enhancing both thermal and electrical conductivity for applications ranging from ball grid arrays, buried vias or PCBs with microvia layers.
CB102 - Next Generation Conductive Via Fill
All of the benefits of our conductive via fill with improved process capabilities for smaller diameter vias.
CB200 - Rigid Copper Shielding & Circuit Formations
With excellent printing properties, silver-like conductivity, and strong adhesion to a wide variety of substrates, DuPont CB200 copper conductors provide an excellent value for on-board electromagnetic interference / radio frequency interference (EMI/RFI) shielding on rigid circuits. They can also be used to fabricate low-voltage circuitry or jumpers in certain applications.
CB028 - Flexible Silver Shielding
Used to provide electromagnetic interference / radio frequency interference (EMI / RFI) shielding on rigid or flexible printed circuit board (PCB) substrates.
CB230 - Print Additive Circuits
DuPont CB230 silver-coated copper conductors are specifically formulated to offer excellent solderability and leach resistance, helping create additive circuitry, electrodes, and termination sites across a wide variety of substrates. Its strong adhesion to a wide variety of substrates makes it an excellent choice for substrates as diverse as aluminum, rigid and flexible polymer laminates, glass, and ceramic.
CB459 - Thin, High Adhesion Platable Seed Layer
CB459 is an additive that can be used as an overprint for via fills in rigid and flexible laminates. It offers good platability and increased bond strength on epoxy-based, non-conductive via fill materials. This versatile material can be used on a variety of printed circuit board resin systems.
CB500 - Temporary Conductor for Electroplating (Bus Bar)
CB500 is a printed silver conductor ink designed to simplify selective electroplating applications in the manufacturing of PCBs. It eliminates the need for bus bars or other copper plating connections, reduces the chance of forming unintended copper antennae, and removes the need for “after-plating”, ultimately reducing total processing costs.
Product Data Sheets (7)
- CB028 Ag Conductor (PDF)
- CB100 Ag Via Fill (PDF)
- CB102 Conductive Via Plug Paste (PDF)
- CB200 Cu Conductor (PDF)