Removers for LED Fabrication

Removers for LED Fabrication

DuPont EKC Technology offers a specific line of wet chemistries for LED manufacturing.

The production of LED dies can require a variety of wet chemical treatments, and DuPont EKC Technology has put its science to work in formulating solutions for the LED industry designed to enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.

EKC162™ plasma and photoresist residue remover – copper compatible
Formulated to remove the most challenging organic- and plasma-based residues at low operating temperatures. Water-rinsable. Compatible with gallium arsenide (GaAs).

EKC175™ plasma and photoresist residue remover – aluminum compatible
Provides fast and efficient removal of plasma-basedresidues as photoresist. Water-rinsable.

EKC830™ positive tone photoresist remover
Photoresist removal product specifically targeted for positive-tone photoresists. Compatible with anexceptionally broad array of metals.

EKC922™ negative tone photoresist remover
Photoresist removal product specifically targeted for negative-tone photoresists. Compatible with gallium arsenide (GaAs) and an exceptionally broad array of metals. 


  • Post-Etch Residue Removers

    Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.

  • Photoresist Removers

    Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.

  • WLP Photoresist Removers & TSV Cleaners

    Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.

  • Post Clean Treatments

    Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.

  • Post-CMP Cleaners

    Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.