Removers for LED Fabrication
DuPont EKC Technology offers a specific line of wet chemistries for LED manufacturing.
The production of LED dies can require a variety of wet chemical treatments, and DuPont EKC Technology has put its science to work in formulating solutions for the LED industry designed to enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.
EKC162™ plasma and photoresist residue remover – copper compatible
Formulated to remove the most challenging organic- and plasma-based residues at low operating temperatures. Water-rinsable. Compatible with gallium arsenide (GaAs).
EKC175™ plasma and photoresist residue remover – aluminum compatible
Provides fast and efficient removal of plasma-basedresidues as photoresist. Water-rinsable.
EKC830™ positive tone photoresist remover
Photoresist removal product specifically targeted for positive-tone photoresists. Compatible with anexceptionally broad array of metals.
EKC922™ negative tone photoresist remover
Photoresist removal product specifically targeted for negative-tone photoresists. Compatible with gallium arsenide (GaAs) and an exceptionally broad array of metals.
Product Data Sheets (3)
- EKC162™ plasma and photoresist residue remover – copper compatible (PDF)
- EKC800™ Series Positive Photoresist Removers (PDF)
RELATED DUPONT PRODUCTS & SERVICES
Post-Etch Residue Removers
Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.
WLP Photoresist Removers & TSV Cleaners
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing.
Post Clean Treatments
Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.