DUPONT PRODUCTS & SERVICES
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces.
Post clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
Aqueous formulations employed for post-CMP cleaning are designed to protect the planarized metals and dielectrics preventing metal corrosion while providing a smooth defect free wafer surface.
Aqueous & Semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.